Chiplet Summit Announces Its Initial Keynote Schedule With Emphasis on AI Applications
SAN DIEGO -- January 02, 2024 -- The second annual Chiplet Summit, to occur on February 6-8 at the Santa Clara Convention Center, has now set its initial keynote schedule. Speakers will be:
- Subi Kungeri, VP AI System Solutions, Applied Materials
- Abhijeet Chakraborty, VP Engineering, Synopsys
- Gurtej Sandhu, Sr Fellow/VP, Micron
- Tony Chan Carusone, CTO, Alphawave Semi
- Sam Salama, CEO, Hyperion Technologies
- Cliff Grossner and Bapi Vinnakota, Open Compute Project
There will also be short talks by the UCIe Consortium, Silicon Catalyst, and SNIA.
Keynote topics will include AI solutions, design methods, memory, interfaces, new packaging methods, and the open chiplet economy. Attendees will learn how chiplets can make the latest designs take less time, cost less, and be more scalable. Presentations will focus on handling AI applications, such as ChatGPT®.
Summit General Chair Chuck Sobey says, “At our keynotes, attendees hear what industry leaders are planning. AI is an obvious driver everywhere. It requires huge amounts of memory, fast low-latency connections, and the ability to do both training and model execution at top speed. Making it work well takes engineering and R&D that covers all chip design stages.”
To discuss exhibiting, contact:
Elizabeth Leventhal, Exhibit Sales Director
Elizabeth@ChipletSummit.com
+1.760.809.5755
About Chiplet Summit
Chiplet Summit, produced by Semper Technologies, showcases the applications, technologies, and vendors that are driving the chiplet market. To learn more about the Summit, visit https://chipletsummit.com.
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related News
- DreamBig Semiconductor Announces Partnership with Samsung Foundry to Launch Chiplets for World Leading MARS Chiplet Platform on 4nm FinFET Process Technology Featuring 3D HBM Integration to Solve Scale-up and Scale-out Limitations of AI for the Masses
- ASE Announces FOCoS-Bridge With TSV; Latest Package Technology Reduces Power Loss by 3x for Next-Generation AI and HPC Applications
- CoAsia SEMI Announces AI Chiplet Production Collaboration With Tenstorrent
- Chiplet Summit Announces Keynote Speakers
Latest News
- CEA-Leti, CEA-List and PSMC Collaborate to Integrate RISC-V and MicroLED Silicon Photonics into 3D Stacking and Interposer for Next-Generation AI
- NIST Researchers Develop Photonic Chip Packaging That Can Withstand Extreme Environments
- Rebellions Closes $400 Million Pre-IPO and Launches RebelRack™ and RebelPOD™ to Accelerate Global Expansion
- EdgeCortix Looks To Chiplets For Third-Gen Reconfigurable AI Chip
- Agileo Automation Launches Agil'EDA to Accelerate SEMI EDA Adoption for Semiconductor Equipment OEMs