Cadence, Siemens back ARM automotive chiplet push
By Nick Flaherty, eeNews Europe (March 14, 2024)
Cadence and Siemens are aiming to boost the use of ARM’s automotive cores in chiplets and system on chip designs with a series of tools. However Synopsys is so far missing from the series of orchestrated announcements.
Synopsys is also a key supporter of ARM in automotive and a leading developer of chiplet design tools and IP. However it has its own competing IP cores based on the ARC and RISC-V architecture, and is currently negotiating with the Chinese authorities to allow its $35bn acquisition of simulation toll maker Ansys.
To read the full article, click here
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related News
- Arm, ASE, BMW Group, Bosch, Cadence, Siemens, SiliconAuto, Synopsys, Tenstorrent and Valeo commit to join imec’s Automotive Chiplet Program
- Cadence Collaborates with Arm to Jumpstart the Automotive Chiplet Ecosystem
- Cadence Accelerates SoC, 3D-IC and Chiplet Design for AI Data Centers, Automotive and Connectivity in Collaboration with Samsung Foundry
- BOS and Tenstorrent Unveil Eagle-N, Industry’s First Automotive AI Accelerator Chiplet SoC
Latest News
- Xanadu and Tower Semiconductor Deepen Strategic Collaboration to Accelerate Photonic Quantum Hardware Innovation
- EV Group Unveils Next-Generation EVG®120 Resist Processing System for High-Volume Manufacturing
- CEA Demonstrates First Dynamically Routed Electro-Optical Router for Photonic Interposers
- Renesas Develops SoC Technologies for Automotive Multi-Domain ECUs Essential for the SDV Era
- Keysight Unveils 3D Interconnect Designer for Chiplet and 3DIC Advanced Package Designs