Cadence, Siemens back ARM automotive chiplet push
By Nick Flaherty, eeNews Europe (March 14, 2024)

Cadence and Siemens are aiming to boost the use of ARM’s automotive cores in chiplets and system on chip designs with a series of tools. However Synopsys is so far missing from the series of orchestrated announcements.
Synopsys is also a key supporter of ARM in automotive and a leading developer of chiplet design tools and IP. However it has its own competing IP cores based on the ARC and RISC-V architecture, and is currently negotiating with the Chinese authorities to allow its $35bn acquisition of simulation toll maker Ansys.
To read the full article, click here
Related Chiplet
- High Performance Droplet
- Interconnect Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Bridglets
- Automotive AI Accelerator
Related News
- Arm, ASE, BMW Group, Bosch, Cadence, Siemens, SiliconAuto, Synopsys, Tenstorrent and Valeo commit to join imec’s Automotive Chiplet Program
- Cadence Collaborates with Arm to Jumpstart the Automotive Chiplet Ecosystem
- Cadence Accelerates SoC, 3D-IC and Chiplet Design for AI Data Centers, Automotive and Connectivity in Collaboration with Samsung Foundry
- Cadence Unveils Arm-Based System Chiplet
Latest News
- Cadence Launches Partner Ecosystem to Accelerate Chiplet Time to Market
- Ambiq and Bravechip Cut Smart Ring Costs by 85% with New Edge AI Chiplet
- TI accelerates the shift toward autonomous vehicles with expanded automotive portfolio
- Where co-packaged optics (CPO) technology stands in 2026
- Qualcomm Completes Acquisition of Alphawave Semi