Cadence, Siemens back ARM automotive chiplet push
By Nick Flaherty, eeNews Europe (March 14, 2024)

Cadence and Siemens are aiming to boost the use of ARM’s automotive cores in chiplets and system on chip designs with a series of tools. However Synopsys is so far missing from the series of orchestrated announcements.
Synopsys is also a key supporter of ARM in automotive and a leading developer of chiplet design tools and IP. However it has its own competing IP cores based on the ARC and RISC-V architecture, and is currently negotiating with the Chinese authorities to allow its $35bn acquisition of simulation toll maker Ansys.
To read the full article, click here
Related Chiplet
- Optical Chiplet
- Reverse Gearbox Chiplet
- FlexGen Multi-Die Smart Network-on-Chip (NoC) IP
- Ncore Multi-Die Interconnect IP
- Integrated voltage regulator (IVR) chiplet
Related News
- Arm, ASE, BMW Group, Bosch, Cadence, Siemens, SiliconAuto, Synopsys, Tenstorrent and Valeo commit to join imec’s Automotive Chiplet Program
- Cadence Collaborates with Arm to Jumpstart the Automotive Chiplet Ecosystem
- Cadence Accelerates SoC, 3D-IC and Chiplet Design for AI Data Centers, Automotive and Connectivity in Collaboration with Samsung Foundry
- Cadence to Buy Artisan to Support Chiplet, 3D IC Future
Latest News
- Staera Semiconductor Emerges from Stealth with US$4.6 Million to Build Light into the Chip and Break AI's Data Bottleneck
- Vertical Compute expands partnership with imec to accelerate commercial manufacturing of Vertically Integrated Memory (VIM)
- Imec advances Europe's silicon interposer technology capabilities through NanoIC pilot line, paving the way for open chiplet design
- SCHMID Group Secures Key Wet-Process Equipment Order for South Asia’s First Glass Core Substrate Manufacturing Facility
- EV Group Helps Accelerate Qubit Scaling for Quantum Computing Through Advanced Packaging Expertise