Ayar Labs CEO: Optical Chiplets Coming to SOCs Soon
By Agam Shah, HPCwire (October 22, 2024)
In AI, time is money. Top AI players are spending billions to create computing infrastructures to satisfy that need for speed. However, these companies are bottlenecked by computing constraints at the chip, memory, and I/O levels, which are slowing down AI. In that regard, startup Ayar Labs is in the right place at the right time.
Ayar Labs has another solution: to replace electrical wires with pulses of light for complex chips and memory to communicate faster over short distances. That will improve the utilization of systems and result in more revenue and productivity.
Ayar Labs’ products are almost ready for prime time, and CEO Mark Wade sat down with HPCwire to discuss the company’s products and path forward.
To read the full article, click here
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related News
- Ayar Labs Names Mark Wade CEO
- Ayar CEO: ‘Copper Is Already Broken; Agentic AI Will Require Optical I/O’
- Ayar Labs Showcases 4 Tbps Optically-enabled Intel FPGA at Supercomputing 2023
- Ayar Labs Adds Silicon Industry Veterans to Accelerate Growth
Latest News
- Avicena Launches the World’s First microLED Optical Interconnect Evaluation Kit for AI Infrastructure Innovators
- Lightmatter Achieves Record 1.6 Tbps Per Fiber to Accelerate AI Optical Interconnect
- Arm Positions Neoverse for AI and Telco Networks at MWC
- NVIDIA Compute Architecture Paves the Way for Scale-Up Optical Interconnects; CPO Penetration in AI Data Centers Expected to Rise Steadily
- CEA-Leti and NcodiN Partner to Industrialize 300 mm Silicon Photonics for Bandwidth-Hungry AI Interconnects