Athos Spins Out Of Mercedes With Chiplet Concept for AVs
By Sally Ward-Foxton, EETimes | October 17, 2025
After five years of technology incubation, Athos Silicon has officially spun out of Mercedes-Benz. The startup was founded in March 2025 based on a research project underway at Mercedes since 2020. Mercedes has made a strategic investment in Athos, including “substantial” IP, according to the company, and the OEM and its spinout will continue to collaborate on Athos’ mSoC reference design, Polaris.
As far back as 2020, the Athos team had been looking at how to address functional safety for autonomy since silicon on the market wasn’t sufficient, Athos CEO Charnjiv Bangar told EE Times.
“That led us on this journey of fundamentally looking at what is needed for highly reliable and safe compute,” he said. “We started with the problem of autonomy, and with problem statements from [Mercedes’] functional safety teams and application teams in Germany, and built the architecture from the ground up.”
To read the full article, click here
Related Chiplet
- Integrated voltage regulator (IVR) chiplet
- High-performance connectivity chiplets
- eFPGA Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
Related News
- Athos Silicon Selects DreamBig Semiconductor’s Chiplet Hub™ for its Safety-Critical mSoC™ Platform Designed Ground-up for Autonomy
- Arteris Selected by 2V Systems for IO Chiplet for Data Center
- Baya Systems Accelerates Global Expansion with New U.K. Office for AI and Chiplet Innovation
- CHASSIS: European mobility, semiconductor, and software heavyweights team up with research in joint initiative for automotive chiplet technology
Latest News
- India’s OSAT-ATMP Build-Out: From Legacy Packages to 2.5D
- Nvidia’s Inference Pivot Reaches Rebellions in Korea
- AMD to Bring UCIe Connectivity to Select AMD Versal Adaptive SoCs
- TSMC’s HBM-Packaging Yield Issues Help Intel, Analysts Say
- Qnity Expands AI-Driven Advanced Packaging Capabilities with End-to-End Process Solutions