ASICLAND Initiates Two Chiplet SoC Development Contracts with Primemas Worth a Total of KRW 16 Billion

• Built on TSMC’s 12nm FinFET process, delivering a high-performance, highly flexible SoC architecture
• Next-generation chiplet SoC platform integrating CXL and eFPGA, introducing a new design paradigm

August 15, 205 --  ASIC design solution leader ASICLAND announced on the 12th that it has signed contracts worth a total of KRW 16 billion with Primemas, a company specializing in the development of chiplet-based SoC platforms.

The contracts center on providing design services for the CXL controller “Falcon-1” and the FPGA chiplet “Kameleon”, both of which are core components of Primemas’s next-generation chiplet SoC platform, Hublet®.

Through this collaboration, ASICLAND aims to strengthen its chiplet-based SoC design capabilities for Primemas’s key SoC products and further enhance its technological competitiveness across next-generation system markets that demand high-performance computing.

Primemas, a Korean-founded fabless company based in the United States, is developing next-generation chiplet SoCs that integrate CXL, Arm, and eFPGA technologies, centered around the Hublet® platform. The company has been experiencing rapid growth through collaborations with major global customers, including the three leading memory manufacturers and hyperscalers.

Under the project scope, ASICLAND will be responsible for backend design, verification (DFT), tape-out, and wafer processing. Notably, Falcon-1 is a hub-type chiplet-based SoC that connects to external memory and accelerators via the CXL 3.2 interface for high-speed data transfer.

The Kameleon chiplet integrates an embedded FPGA (eFPGA) within an accelerator SoC, enabling flexible hardware reconfiguration without redesign in environments where computational structures—such as those used for machine learning or cryptographic algorithms—change frequently. The two chips are interconnected via a die-to-die interface, enabling high-speed communication between modules, and are configured as an integrated SoC platform that fully leverages the advantages of chiplet architecture.

The project will adopt TSMC’s 12-nanometer FinFET process, which achieves both high circuit density and power efficiency in high-performance computing environments. This is expected to meet the market demand for high-performance, low-power semiconductors. ASICLAND plans to leverage these capabilities to deliver optimized design solutions for high-value industries such as data centers, edge computing, and robotics.

Jongmin Lee, CEO of ASICLAND, stated, “This agreement with Primemas is highly significant as it marks our full-scale entry into the rapidly growing global ecosystem for CXL and chiplet-based SoCs. Beyond securing next-generation semiconductor design technologies, we will accelerate our efforts to expand our customer base and build a track record of global collaboration.”