Arm Reportedly Weighs Chiplet and Solution Development, Raising Customer Tensions
By Trendforce
July 31, 2025 -- Arm CEO Rene Haas said the company is stepping up investment in the potential development of chiplets and integrated solutions, according to a report from Reuters.
As Reuters notes, Haas did not provide a timeline for when these investments might begin to generate profits, nor did he share specifics about potential products in development. However, he did mention that the company is exploring a broad range of chiplet-related possibilities, including “a physical chip, a board, a system, all of the above.”
The company may develop chiplets that can be integrated into custom chips, or it might opt to design complete chips on its own, according to CNBC.
To read the full article, click here
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related News
- AMI Brings Firmware Expertise to Arm Total Design Ecosystem to Simplify and Accelerate Development for Arm-based Custom Chiplet Solutions
- AMI Launches Developer Program for Arm Total Design to Rapidly Accelerate Arm-based Chiplet Development
- Draper Joins Intel Foundry Chiplet Alliance to Support Development of Interoperable and Secure Chiplet Solutions
- Socionext Announces Collaboration with Arm and TSMC on 2nm Multi-Core Leading CPU Chiplet Development
Latest News
- Lightmatter Unveils Guide DR: Industry First Liquid-Cooled Laser NIC that Quadruples Rack Density
- EXTOLL and Chip Interfaces introduce the Industry´s first Integrated UCIe IP Solution for GlobalFoundries FDX Technology
- Lam Research Establishes Panel-Level Packaging Center of Excellence in Salzburg, Austria
- AMD Announces More Than $10 Billion in Taiwan Ecosystem Investments to Accelerate AI Infrastructure
- Asahi Kasei Develops Novel Photosensitive Polyimide Film for Advanced Panel-Level Semiconductor Packaging