400Gbps/800Gbps IOWN APN demonstration at OFC2024 by multi-vendor products leveraging photonics-electronics convergence device and open standards
2024-03-26 07:48:00
Interconnects & Integration
Chiplet Recent Updates - Page 36 of 44
Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips
2024-03-25 18:17:00
Business & Deals
Marvell Demonstrates Industry’s First 200G 3D Silicon Photonics Engine to Scale Accelerated Infrastructure
2024-03-25 15:26:00
Interconnects & Integration
Celestial AI Announces Photonic Fabric™ Adoption by Lead Hyperscaler Customers
2024-03-25 13:44:00
Business & Deals
MediaTek launches next-generation ASIC design platform with co-packaged optics solutions at OFC 2024
2024-03-25 13:15:00
Interconnects & Integration
Avicena Announces Scalable Sub-pJ/bit LightBundle™ Chiplet Interconnect with 10m Reach
2024-03-25 11:29:00
Interconnects & Integration
Synopsys looks to AI, 3D die for trillion transistor designs
2024-03-22 08:56:00
Analysis & Commentary
Ayar Labs to Showcase Optical Interconnect Solutions to Redefine AI Infrastructure at OFC 2024
2024-03-22 07:35:00
Other
Arizona State University and Deca Technologies to Pioneer North America’s First R&D Center for Advanced Fan-Out Wafer-Level Packaging
2024-03-21 09:42:00
Interconnects & Integration
ASE’s VIPack™ Enables Innovational AI Devices Through Advanced Interconnect Technology for Chiplets
2024-03-20 15:42:00
Interconnects & Integration
RANOVUS delivers industry’s first 6.4Tbps Co-Packaged Optics with integrated laser for AI/ML application at OFC 2024
2024-03-20 15:13:00
Interconnects & Integration
3D-IC Intensifies Demand For Multi-Physics Simulation
2024-03-20 13:19:00
Analysis & Commentary
Understanding 3DIC, Heterogeneous Integration, SiP, and Chiplets at Once
2024-03-19 15:24:00
Analysis & Commentary
The Era of Heterogeneous Integration Approaches: Who Shall Dominate the Advanced Packaging Field?
2024-03-19 15:18:00
Analysis & Commentary
After TSMC fab in Japan, advanced packaging facility is next
2024-03-18 13:18:00
Analysis & Commentary
NTT looks to 15Tbit/s chiplet optical interconnects
2024-03-18 11:04:00
Analysis & Commentary
Adeia Presents Metrology Techniques for Improved Yield in Hybrid Bonding at IMAPS Device Packaging Conference 2024
2024-03-15 11:27:00
Other
Tata Electronics bets big on Singapore-based semiconductor co Silicon Box
2024-03-15 07:42:00
Analysis & Commentary
Current And Future Challenges For An Open Chiplet Ecosystem
2024-03-14 13:57:00
Analysis & Commentary
SiPearl looks to automotive chiplets
2024-03-14 13:49:00
Business & Deals