Putting 3D IC to work for you

By Todd Burkholder and Tony Mastroianni

September 16, 2025

3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitation. By breaking functional systems into sub-functional chiplets and using advanced packaging integration technologies, we can create more complex, more powerful systems than ever before.

The challenge—and opportunity—for the industry is to lower the barriers to adoption of 3D IC design so that its benefits can become available industry-wide and not just the bleeding edge markets. Thus, the Chiplet Design Exchange (CDX) was formed within the Open Compute Project with the mission of developing easy-to-use, machine-readable design kits (3DKs).

With participation from EDA vendors, foundries, OSATs, and materials providers, the goal was to define standards and workflows for 3D IC design. In other words, a neutral, open foundation that enables efficient chiplet integration and reuse, accelerates innovation, and guarantees manufacturability across organizational boundaries.

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