Industry Standards for Chiplets and Their Role In Test

By Jeorge S. Hurtarte, Teradyne

November 19, 2024

As the semiconductor industry increasingly moves to chiplets, 2.5D/3D packaging, and heterogeneous integration, there are significant new challenges for test. Leaders like Teradyne have the technologies necessary to respond and innovate, but to keep the industry running smoothly, we need effective collaboration, and that demands standardization.

There are multiple areas where standards are important in the test ecosystem, to enable efficient collaboration, encourage innovation, and improve test efficiency. At a high level, these standards all relate to the testing and communication protocols for integrated circuits (ICs) and semiconductor devices, enabling interoperability, data transfer, and reliability in advanced systems.

To read the full article, click here