AI Chiplets
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Quad Core RISC-V with AI Chiplet
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HBM3e Advanced-packaging chiplet for all workloads
- Scalable AI, fortified with high compute density and ample memory bandwidth
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100G optical I/O chiplets
- RANOVUS®’ Odin® optical I/O cores set industry benchmarks for high bandwidth, low power consumption and small size for AI, cloud, metaverse, and communications applications
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Memory Chiplet
- Stealth Mode Products design to disrupt AI/Generative AI processing.
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Hub Chiplet
- Rich pluggable SoC infrastructure that can help accelerators and CXL solutions reach the market 5x-10x faster with over 10x cost reduction
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Machine learning accelerator chiplet implemented in 12nm
- 3 TOPS peak performance AI accelerator
- Hardware accelerated ReLU/Softmax nonlinearities
- Hardware accelerated transpose
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UCIe AP based 8-bit 170-Gsps Chiplet Transceiver
- 2T2R chiplet configuration
- 160/175-GSa/s sample rate
- 7-bit resolution
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Transceiver Chiplet
- Die-level transceiver products with AIB or SerDes interfaces
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High-Density Electronic-Photonic Chiplet
- Parallel electrical interface
- Supports AIB and other proprietary parallel interfaces
- 8 full-duplex optical ports
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Arm Compute Chiplet