AI Chiplets
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10)
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Automotive AI Accelerator
- Eagle-N, the first of Eagle Chiplet SoC Family is an Automotive AI Accelerator which is a unique product in the market targeting IVI and ADAS acceleration based on PCIe interface or UCIe interface with host AP.
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FlexGen Multi-Die Smart Network-on-Chip (NoC) IP
- 10x productivity boost
- Expert-level results
- Wire length reduction-driven performance
- Chiplet ready, multi-die interconnect
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Ncore Multi-Die Interconnect IP
- Scale Performance with Multi-Die Coherency
- Increase Bandwidth and Reduce Latency
- Tune Systems for Flexibility and Design Requirements
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Integrated voltage regulator (IVR) chiplet
- In-package voltage regulation for improved efficiency and performance.
- Reduced board-level complexity and external power components.
- Real-time control and feedback for dynamic system optimization.
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High-performance connectivity chiplets
- PCIe and CXL-based connectivity for chiplet and system-level communications.
- High-bandwidth, low-latency data movement across compute, memory, and IO domains.
- Reusable IO architecture that reduces engineering effort across AI designs.
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eFPGA Chiplet
- Optimized Performance for Advanced Computing
- Reduced Development Risk and Faster Time-to-Market
- MOSAICS-Ready Chiplet Architecture
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HBM3e Advanced-packaging chiplet for all workloads
- Scalable AI, fortified with high compute density and ample memory bandwidth
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100G optical I/O chiplets
- RANOVUS®’ Odin® optical I/O cores set industry benchmarks for high bandwidth, low power consumption and small size for AI, cloud, metaverse, and communications applications
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Memory Chiplet
- Stealth Mode Products design to disrupt AI/Generative AI processing.
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Hub Chiplet
- Rich pluggable SoC infrastructure that can help accelerators and CXL solutions reach the market 5x-10x faster with over 10x cost reduction