Optical Chiplet Interconnect Promises to Accelerate Computing Apps
By Alix Paultre, ElectronicDesign (September 17, 2024)
Avicena’s founder and CEO breaks down the challenges of intra-chip data management and how his company’s LightBundle platform offers a solution.
To read the full article, click here
Related Chiplet
- Interconnect Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related News
- Ayar Labs to Showcase Optical Interconnect Solutions to Redefine AI Infrastructure at OFC 2024
- Eliyan Ports Industry’s Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X
- Keysight Expands Chiplet Interconnect Standards Support in Chiplet PHY Designer 2025
Latest News
- Marvell Eyeing Connectivity as the Next Big Thing in AI
- Rebellions and Red Hat Introduce Red Hat OpenShift AI Powered by Rebellions NPUs to Fuel Choice and Flexibility in Enterprise AI
- Arteris to Expand Portfolio with Acquisition of Cycuity, a Leader in Semiconductor Cybersecurity Assurance
- CEA-Leti & STMicroelectronics’ Paper at IEDM 2025 Demonstrates Path to Fully Monolithic Silicon RF Front-Ends with 3D Sequential Integration
- Qualcomm Acquires Ventana Micro Systems, Deepening RISC-V CPU Expertise