Compute & Acceleration Chiplet

Compute & Acceleration Chiplet deliver scalable processing power for modern heterogeneous systems, enabling high-performance computing through modular, multi-die architectures. These chiplets are designed to be combined with memory, interconnect, and IO chiplets to build flexible, power-efficient systems tailored to specific workloads.

This category includes CPU, GPU, AI/ML, FPGA, and domain-specific accelerator Chiplet, targeting applications such as AI training and inference, HPC, data center scale-up and scale-out, networking, and edge computing. By disaggregating compute functions into reusable dies, chiplet-based architectures improve yield, accelerate time-to-market, and allow system designers to mix and match best-in-class compute technologies.

Compute & Acceleration Chiplet are typically integrated using advanced packaging technologies such as 2.5D and 3D stacking, and connected via high-bandwidth die-to-die interconnects (e.g. UCIe). This modular approach is becoming foundational to next-generation AI platforms and heterogeneous computing systems.