NHanced Semiconductors & University of Florida to Present Chiplet Paper at 36th Electronics Packaging Symposium

The paper presents a comprehensive technical roadmap and process assessment of using hybrid bonding to integrate fine pitch chiplet architectures 

NISKAYUNA, NY – August 20, 2025 – At the upcoming 36th Electronics Packaging Symposium, held September 3 – 4, 2025, NHanced Semiconductors and a team from the University of Florida will present a technical paper – “The Future of Electronics Packaging: Chiplet Architecture and AI Defect Inspection” – describing how copper-to-copper hybrid bonding enables chiplet interfaces at sub-10µm pitches to increase interconnect densities in advanced packaging assemblies.

NHanced vice-president Dr. Charles Woychik will present the paper, co-authored with U F’s Pavanbabu Arjunamahanthi, et al. from the Department of Electrical & Computer Engineering, during the Symposium’s session on Heterogeneous Integration.

The paper examines the emerging chiplet ecosystem including process architectures, integration flow, and fabrication challenges associated with hybrid bonding for chiplet-to-wafer packaging. Also included are standardization trends, such as Universal Chiplet Interconnect Express (UCIe), that guide the development of scalable, high-yield chiplet integration platforms.

According to Woychik, “Hybrid bonding has emerged as a leading solution for fine-pitch die-to-die chiplet integration with robust electrical, mechanical, and thermal continuity. These characteristics are particularly beneficial in chiplet architectures for high performance computing.”

The 36th Annual Electronics Packaging Symposium will be held at the GE Aerospace Research Center in Niskayuna, NY from September 3 - 4, 2025. The conference is organized by the University of Binghamton’s Integrated Electronics Engineering Center and The Center for Advanced Microelectronics Manufacturing, in conjunction with GE Aerospace and IBM Research. The Symposium is focused on electronic packaging and the evolution of advanced packaging toward a chiplet future. Registration for the event is available here.

About NHanced Semiconductors, Inc.

Based in the US, NHanced Semiconductors is the world’s first pure-play advanced packaging foundry, specializing in leading-edge BEoL semiconductor technologies. Its capabilities include chiplets, 3D-ICs, silicon interposers, 2.5D, additive silicon manufacturing, photonics, microfluidics, and other innovative technologies. The foundry works with both standard and non-standard substrates, III‑V compound semiconductors, and many specialized materials.

Headquartered in Illinois, NHanced has a development and manufacturing facility near Research Triangle Park, NC, performing small volume manufacturing, in-house process development, and customer prototyping, and an advanced packaging and assembly facility in Odon, IN. For more information, please visit: https://nhanced-semi.com/