Chiplets and Automotive Computing – Interview with Bart Placklé, Imec
Chiplet architectures are redefining the automotive industry. Imec’s Bart Placklé explains how modular design, interoperability, and ecosystem collaboration can help Europe regain leadership in high-performance vehicle computing.
By Benjamin Müller, Automotive Digital Transformation | November 4, 2025
With more than two decades of experience in automotive and semiconductor technology, Bart Placklé has shaped some of the most fundamental transformations in the industry – from infotainment consolidation and domain controller evolution to Intel’s early autonomous mobility programs. As Vice President Automotive at Imec, he now leads efforts to advance chiplet integration as a foundation for next-generation high-performance automotive computing.
At the Automotive Computing Conference 2025, Placklé will speak about the structural and economic limits of traditional SoC design and why open, interoperable chiplet ecosystems are the key to scalable, sovereign computing in Europe. In the run-up to the conference, we spoke with him about the technological and structural shifts driving the future of automotive computing.
To read the full article, click here
Related Chiplet
- Interconnect Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related News
- Cadence Accelerates SoC, 3D-IC and Chiplet Design for AI Data Centers, Automotive and Connectivity in Collaboration with Samsung Foundry
- Arteris Addresses Silicon Design Reuse Challenge with New Magillem Packaging Product for IP Blocks and Chiplets
- Electrical Engineering and Computer Science Department Chair Alex K. Jones and Professor Bryan Kim Receive NSF Grant to Develop Energy-Efficient Chiplets for Data Centers
- AI and Chiplets Prominent at TSMC OIP 2025
Latest News
- Chiplets and Automotive Computing – Interview with Bart Placklé, Imec
- EdgeCortix Closes Oversubscribed Series B, Bringing Total Funding Over $110M Amid Growing Edge AI Demand
- Adeia Initiates Patent Infringement Litigation Against AMD
- ASE Unveils IDE 2.0 – AI-Enhanced Platform Accelerates Package Design Accuracy and Innovation
- Chiplet-Based Solutions Accelerate the Development of Embedded NVM