China forms its own chiplet standard amid isolation
By Peter Clarke, eeNews Analog (March 27, 2023)

The China Chiplet Industry Alliance has released the ‘Chiplet Interconnection Interface Standard’ known as ACC1.0, according to the Financial Association Press.
The standard defines a high-speed serial port and is focused on optimization based on the domestic packaging and substrate supply chain, with cost and commercial practicality as a key consideration, the report said. The standard was developed by the Cross Information Core Technology Research Institute working with the China Chiplet Industry Alliance, which includes domestic system, IP, and packaging manufacturers.
To read the full article, click here
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related News
- Tenstorrent Announces Open Chiplet Atlas™ Ecosystem to Accelerate and Standardize an Open Chiplet Ecosystem
- Alphawave Semi Drives Innovation in Hyperscale AI Accelerators with Advanced I/O Chiplet for Rebellions Inc
- BOS and Tenstorrent Unveil Eagle-N, Industry’s First Automotive AI Accelerator Chiplet SoC
- Arm Chiplet System Architecture Makes New Strides in Accelerating the Evolution of Silicon
Latest News
- CoAsia SEMI Commences Supply of 3D IC SoCs: Korea’s First Case, Positioning 3D IC as the Next HBM
- Eliyan Secures $50 Million in Strategic Investments from Leading Hyperscalers and AI Infrastructure Providers to Accelerate Scalable AI Systems
- Veeco and imec develop 300mm compatible process to enable integration of barium titanate on silicon photonics
- Lightmatter Introduces Guide Light Engine for AI, Featuring VLSP Technology
- Lightmatter and GUC Partner to Produce Co-Packaged Optics (CPO) Solutions for AI Hyperscalers