Cadence to Buy Artisan to Support Chiplet, 3D IC Future
By Yashasvini Razdan, EETimes | April 29, 2025
Cadence Design Systems has entered into a definitive agreement to acquire Arm’s Artisan Foundation IP business, complementing its AI and chiplet ambitions. This includes standard cell libraries, memory compilers, and GPIOs—components critical for advanced node SoCs and modular designs.
“With the addition of Arm’s Artisan IP, Cadence will enter the foundation IP market and support new growth across design services and chiplet offerings,” said Boyd Phelps, SVP and GM of the silicon solutions group at Cadence.
To read the full article, click here
Related Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Interconnect Chiplet
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related News
- Cadence Accelerates SoC, 3D-IC and Chiplet Design for AI Data Centers, Automotive and Connectivity in Collaboration with Samsung Foundry
- TSMC Announces Breakthrough Set to Redefine the Future of 3D IC
- UMC Launches W2W 3D IC Project with Partners, Targeting Growth in Edge AI
- UMC Introduces Industry’s First 3D IC Solution for RFSOI, Accelerating Innovations in the 5G Era
Latest News
- Syenta Raises A$8.8M to Break AI’s Memory Wall with Next-Gen Chip Packaging Technology
- ASICLAND Initiates Two Chiplet SoC Development Contracts with Primemas Worth a Total of KRW 16 Billion
- OKI Develops Tiling crystal film bonding (CFB) Technology for Heterogeneous Integration of Optical Semiconductors onto 300 mm Silicon Wafers
- Cadence Accelerates Development of Billion-Gate AI Designs with Innovative Power Analysis Technology Built on NVIDIA
- Celestial AI Closes Final Series C1 Round to Accelerate Next-Generation AI Computing