Cadence to Buy Artisan to Support Chiplet, 3D IC Future
By Yashasvini Razdan, EETimes | April 29, 2025
Cadence Design Systems has entered into a definitive agreement to acquire Arm’s Artisan Foundation IP business, complementing its AI and chiplet ambitions. This includes standard cell libraries, memory compilers, and GPIOs—components critical for advanced node SoCs and modular designs.
“With the addition of Arm’s Artisan IP, Cadence will enter the foundation IP market and support new growth across design services and chiplet offerings,” said Boyd Phelps, SVP and GM of the silicon solutions group at Cadence.
To read the full article, click here
Related Chiplet
- Interconnect Chiplet
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
- HBM3e Advanced-packaging chiplet for all workloads
Related News
- TSMC Announces Breakthrough Set to Redefine the Future of 3D IC
- UMC Launches W2W 3D IC Project with Partners, Targeting Growth in Edge AI
- UMC Introduces Industry’s First 3D IC Solution for RFSOI, Accelerating Innovations in the 5G Era
- System-level UCIe IP for early architecture analysis of 3D Chiplet Design and Packaging
Latest News
- Powering AI with Chiplet Innovation: MSquare's ML100 IO Die Live at COMPUTEX 2025
- Advanced IC Packaging: The Roadmap to 3D IC Semiconductor Scaling
- India’s OSAT Ambitions: Flying High or a Flight Risk?
- Deca Announces Agreement with IBM to Bring High-Density Fan-Out Interposer Production to North America
- AEM Expands Access to Production-Proven SLT and Burn-In Ecosystem for Advanced Computing Customers