World’s first UCIe heterogeneous chiplet test chip
By Nick Flaherty, eeNews Europe (December 18, 2023)
Synopsys and Intel have developed the first test chip with the Universal Chiplet Interconnect Express (UCIe) protocol used to connect chiplets made on different processes.
The test chip demonstrated UCIe traffic between Synopsys UCIe PHY IP and Intel UCIe PHY IP, simulating each test chip using the Synopsys VCS functional verification tool.
Intel’s test chip, Pike Creek, consists of an Intel UCIe IP chiplet fabricated on Intel 3 technology and was paired with a Synopsys UCIe IP test chip fabricated on the TSMC N3 process. The successful pairing mimics the mixing and matching of dies that can occur in real-world multi-die systems, demonstrating that this approach is commercially viable.
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