SK hynix Reportedly Plans to Implement Chiplet Technology in Memory Controllers within Three Years
As designing and manufacturing large monolithic ICs became more complex, related challenges regarding yield and cost have emerged for semiconductor companies, which boosts the popularity of chiplets. Now the wave has been spreading to the memory sector. According to a report by TheElec, SK hynix intends to integrate the chiplet technology into its memory controllers over the next three years to improve cost management.
In January, the company applied for a brand name called MOSAIC, which represents its chiplet technology, the report notes.
Citing SK hynix Executive Vice President Moon Ki-ill, the report notes that the company currently collaborates with TSMC as the foundry for manufacturing its controllers.
To read the full article, click here
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related News
- SK hynix Ramps up CXL Push with First In-House Controller, Reportedly to be Built by TSMC
- SK hynix Signs Investment Agreement of Advanced Chip Packaging with Indiana
- SK hynix Partners with TSMC to Strengthen HBM Technological Leadership
- SK hynix Signs Preliminary Memorandum of Terms with U.S. Department of Commerce for Advanced Packaging Facility in Indiana
Latest News
- Avicena Launches the World’s First microLED Optical Interconnect Evaluation Kit for AI Infrastructure Innovators
- Lightmatter Achieves Record 1.6 Tbps Per Fiber to Accelerate AI Optical Interconnect
- Arm Positions Neoverse for AI and Telco Networks at MWC
- NVIDIA Compute Architecture Paves the Way for Scale-Up Optical Interconnects; CPO Penetration in AI Data Centers Expected to Rise Steadily
- CEA-Leti and NcodiN Partner to Industrialize 300 mm Silicon Photonics for Bandwidth-Hungry AI Interconnects