SK hynix Reportedly Plans to Implement Chiplet Technology in Memory Controllers within Three Years
As designing and manufacturing large monolithic ICs became more complex, related challenges regarding yield and cost have emerged for semiconductor companies, which boosts the popularity of chiplets. Now the wave has been spreading to the memory sector. According to a report by TheElec, SK hynix intends to integrate the chiplet technology into its memory controllers over the next three years to improve cost management.
In January, the company applied for a brand name called MOSAIC, which represents its chiplet technology, the report notes.
Citing SK hynix Executive Vice President Moon Ki-ill, the report notes that the company currently collaborates with TSMC as the foundry for manufacturing its controllers.
To read the full article, click here
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related News
- SK hynix Ramps up CXL Push with First In-House Controller, Reportedly to be Built by TSMC
- SK hynix Signs Investment Agreement of Advanced Chip Packaging with Indiana
- SK hynix Partners with TSMC to Strengthen HBM Technological Leadership
- SK hynix Signs Preliminary Memorandum of Terms with U.S. Department of Commerce for Advanced Packaging Facility in Indiana
Latest News
- Tower Semiconductor Signs Customer Contracts for $1.3 Billion Silicon Photonics Revenue for 2027
- IC-Link by imec joins TSMC 3DFabric® Alliance to accelerate advanced packaging and 3D IC innovation
- EXTOLL announces Availability of Industry's first 16G UCIe PHY IP in GlobalFoundries 22FDX/22FDX+ Ready for Customer Integration
- NHanced Semiconductors & the University of Florida to Present on Hybrid Bonding Reliability at the 2026 Electronic Components & Technology Conference in Orlando
- Wooptix Targets AI Packaging Bottleneck with Astronomy Tech