Samsung and Arm Forge Ahead with Next-Gen AI Chiplet Technology
By Sakchi Khandelwal, BNN
In a pivotal move that is set to redefine the landscape of mobile computing and AI, Samsung Electronics Co., Ltd., in collaboration with Arm, announced on February 20, 2024, the delivery of the next generation Arm Cortex-X CPU, optimized on Samsung Foundry’s most advanced Gate-All-Around (GAA) process technology. This partnership not only aims to propel the capabilities of mobile computing to unprecedented heights but also sets the foundation for a new era of generative AI applications.
A Groundbreaking Partnership
The alliance between Samsung and Arm is not new, with millions of devices already leveraging Arm CPU intellectual property on various Samsung process nodes. However, this latest announcement marks a significant milestone in the evolution of semiconductor technology. The focus is on the development of a new class of System on Chips (SoCs) with enhanced generative AI capabilities. By bringing together Samsung’s cutting-edge 2-nanometer GAA process technology and Arm’s Cortex-X CPU, this collaboration is poised to offer unparalleled power, performance, and efficiency.
To read the full article, click here
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related News
- Cadence Accelerates SoC, 3D-IC and Chiplet Design for AI Data Centers, Automotive and Connectivity in Collaboration with Samsung Foundry
- Rebellions Raises $250 Million to Advance the Next Generation AI Infrastructure, Backed by Arm and Samsung
- ADTechnology Partners with Arm, Samsung Foundry, and Rebellions on AI CPU Chiplet Platform
- Rebellions Partners with Arm, Samsung Foundry, and ADTechnology on Next-Gen AI Computing Chiplet Technology
Latest News
- NLM Photonics and Spark Photonics Partner to Advance Organic Hybrid Solutions
- Marvell Announces Acquisition of Polariton Technologies, Advancing Optical Performance Scaling to 3.2T and Beyond
- Alchip to Showcase Advanced AI ASIC Technologies at TSMC 2026 Technology Symposium
- CEZAMAT Boosts Advanced Photonics R&D with State-of-the-Art UV Nanoimprint System from EV Group
- Pat Gelsinger joins Syenta's board as Playground Global and NRF lead A$37M raise