Optical Transmission Modulation Methods Advance
By Robert Huntley, EETimes Europe (November 21, 2024)
With our society’s instantiable appetite for consuming vast amounts of data, it is no surprise that the back-end data networks must constantly evolve. Most high-throughput data networks rely on optical transmission methods to transfer data, with two dominant modulation techniques: 4-level pulse amplitude modulation (PAM4) and coherent modulation. PAM4, where each amplitude level represents two bits, is a bandwidth-efficient modulation technique that suits short-range (< 10km) applications. Coherent modulation, which involves the modulation of a coherent light source’s amplitude, phase and polarization, is more suited to high-speed, long-distance (>10km) transmission. Both modulation techniques are in demand as the race is on to achieve transfer rates of up to 800 Gbps. There are signs that as each technique evolves, the differences in cost, simplicity and power consumption between them will reduce.
EE Times Europe spoke with Tony Chan Carusone, chief technology officer of Alphawave Semi (London, U.K.), to discover the underlying applications driving bandwidth demand and to find out if PAM4 and coherent modulation techniques are ever likely to converge.
To read the full article, click here
Related Chiplet
- Integrated voltage regulator (IVR) chiplet
- High-performance connectivity chiplets
- eFPGA Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
Related News
- ASMPT and IBM Deepen Collaboration to Advance Bonding Methods for Chiplet Packages for AI
- Tower Semiconductor Teams with NVIDIA to Advance AI Infrastructure with 1.6T Data Center Optical Modules
- POET Technologies and Lumilens Advance Wafer-Level Photonic Integration for Next-Generation AI Optical Networks
- Sivers & GlobalFoundries Advance AI Data Center Optical Solutions
Latest News
- proteanTecs Unveils Advanced Packaging Solutions to Improve Yield, Performance, and Reliability of Multi-Die Systems
- JCET Advances High-Aspect-Ratio TSV Technology for 2.5D and 3D Packaging
- Semiconductor Research Corporation Launches SPARC, Accelerating Industry-Driven University Research for the Next Generation of Semiconductor Innovation
- The world’s first technology 'Silicon Motherboard' Circuits are formed on both sides of the silicon substrate, reducing mounting footprint by 80%
- Avicena Ships World's First 1Tbps Evaluation Kits, Extending Its Leadership in microLED Optical Interconnects