Optical Transmission Modulation Methods Advance
By Robert Huntley, EETimes Europe (November 21, 2024)
With our society’s instantiable appetite for consuming vast amounts of data, it is no surprise that the back-end data networks must constantly evolve. Most high-throughput data networks rely on optical transmission methods to transfer data, with two dominant modulation techniques: 4-level pulse amplitude modulation (PAM4) and coherent modulation. PAM4, where each amplitude level represents two bits, is a bandwidth-efficient modulation technique that suits short-range (< 10km) applications. Coherent modulation, which involves the modulation of a coherent light source’s amplitude, phase and polarization, is more suited to high-speed, long-distance (>10km) transmission. Both modulation techniques are in demand as the race is on to achieve transfer rates of up to 800 Gbps. There are signs that as each technique evolves, the differences in cost, simplicity and power consumption between them will reduce.
EE Times Europe spoke with Tony Chan Carusone, chief technology officer of Alphawave Semi (London, U.K.), to discover the underlying applications driving bandwidth demand and to find out if PAM4 and coherent modulation techniques are ever likely to converge.
To read the full article, click here
Related Chiplet
- Optical Chiplet
- Reverse Gearbox Chiplet
- FlexGen Multi-Die Smart Network-on-Chip (NoC) IP
- Ncore Multi-Die Interconnect IP
- Integrated voltage regulator (IVR) chiplet
Related News
- ASMPT and IBM Deepen Collaboration to Advance Bonding Methods for Chiplet Packages for AI
- Tower Semiconductor Teams with NVIDIA to Advance AI Infrastructure with 1.6T Data Center Optical Modules
- POET Technologies and Lumilens Advance Wafer-Level Photonic Integration for Next-Generation AI Optical Networks
- Sivers & GlobalFoundries Advance AI Data Center Optical Solutions
Latest News
- Amkor Technology and NVIDIA Advance Strategic Partnership for AI Infrastructure
- Siemens expands agentic AI collaboration to tackle 3D IC power and thermal challenges with NVIDIA
- Photon Bridge Raises €10M to Tackle AI’s Emerging Laser Bottleneck
- Abacus Semiconductor and Aalto University Announce Research Cooperation on High-Speed Chiplet Interconnects
- UK Launches Semiconductor Catapult to Strengthen Sovereign Capabilities in AI Hardware and Defence