Optical Chiplet Interconnect Promises to Accelerate Computing Apps
By Alix Paultre, ElectronicDesign (September 17, 2024)
Avicena’s founder and CEO breaks down the challenges of intra-chip data management and how his company’s LightBundle platform offers a solution.
To read the full article, click here
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related News
- Ayar Labs to Showcase Optical Interconnect Solutions to Redefine AI Infrastructure at OFC 2024
- Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X
- Keysight Expands Chiplet Interconnect Standards Support in Chiplet PHY Designer 2025
- ISSCC 2025: Intel Propels Chiplet Interconnect Speed and Flexibility
Latest News
- GSOC Solutions and Andes Technology Announce Strategic Partnership to Expand RISC-V CPU Options for Configurable SoC and Chiplet Platforms
- SK hynix unveils ‘iHBM’ thermal solution to boost AI performance
- Global Unichip Corp (GUC) showcases VSORA’s Jotunn8 AI inference processor at the TSMC Europe Technology Symposium
- Lightmatter Unveils Guide DR: Industry First Liquid-Cooled Laser NIC that Quadruples Rack Density
- EXTOLL and Chip Interfaces introduce the Industry´s first Integrated UCIe IP Solution for GlobalFoundries FDX Technology