NHIZ promotes chiplet industry's development and cooperation
April 24, 2025 -- The Chiplet Industry Ecosystem Development Cooperation Exchange event was held in the Nantong National High-tech Industrial Development Zone (NHIZ) on April 19. It was jointly organized by NHIZ, Fudan University, and Zhiju Semiconductor (Nantong) Co.
As a pivotal technology in the global semiconductor industry transformation, chiplets boast unique advantages in heterogeneous integration and cost-effective efficiency enhancement.
To enhance the competitiveness of the integrated circuit industry, NHIZ has introduced Zhiju Semiconductor's Chiplet Module Manufacturing Project. The project, which has a total investment of 1.05 billion yuan ($143.86 million), officially commenced construction on Feb 9 this year.
The exchange event aims to establish an ecological development mechanism for the rapid industrialization of scientific achievements. Through collaboration between universities, enterprises, government resources, industry, and research, the initiative seeks to establish NHIZ as an innovation powerhouse for chiplet technology.
NHIZ has been focusing on the development of the integrated circuit industry in recent years. It has attracted leading enterprises in the field, including Shennan Circuits Co and Fortune Precision Co, gradually forming an industrial chain spanning design, manufacturing, packaging, and testing.

The Nantong National High-tech Industrial Development Zone.
Related Chiplet
- High Performance Droplet
- Interconnect Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Bridglets
- Automotive AI Accelerator
Related News
- Analogue Insight and Tetrivis Announce Joint Development of “Eurytion RFK1”, a UCIe based 12 nm Ka/Ku-Band RF Chiplet Transceiver
- Draper Joins Intel Foundry Chiplet Alliance to Support Development of Interoperable and Secure Chiplet Solutions
- Arm Reportedly Weighs Chiplet and Solution Development, Raising Customer Tensions
- Renesas Unveils Industry’s First Automotive Multi-Domain SoC Built with 3-nm Process Technology with Chiplet Extensions
Latest News
- Cadence Launches Partner Ecosystem to Accelerate Chiplet Time to Market
- Ambiq and Bravechip Cut Smart Ring Costs by 85% with New Edge AI Chiplet
- TI accelerates the shift toward autonomous vehicles with expanded automotive portfolio
- Where co-packaged optics (CPO) technology stands in 2026
- Qualcomm Completes Acquisition of Alphawave Semi