NHIZ promotes chiplet industry's development and cooperation
April 24, 2025 -- The Chiplet Industry Ecosystem Development Cooperation Exchange event was held in the Nantong National High-tech Industrial Development Zone (NHIZ) on April 19. It was jointly organized by NHIZ, Fudan University, and Zhiju Semiconductor (Nantong) Co.
As a pivotal technology in the global semiconductor industry transformation, chiplets boast unique advantages in heterogeneous integration and cost-effective efficiency enhancement.
To enhance the competitiveness of the integrated circuit industry, NHIZ has introduced Zhiju Semiconductor's Chiplet Module Manufacturing Project. The project, which has a total investment of 1.05 billion yuan ($143.86 million), officially commenced construction on Feb 9 this year.
The exchange event aims to establish an ecological development mechanism for the rapid industrialization of scientific achievements. Through collaboration between universities, enterprises, government resources, industry, and research, the initiative seeks to establish NHIZ as an innovation powerhouse for chiplet technology.
NHIZ has been focusing on the development of the integrated circuit industry in recent years. It has attracted leading enterprises in the field, including Shennan Circuits Co and Fortune Precision Co, gradually forming an industrial chain spanning design, manufacturing, packaging, and testing.

The Nantong National High-tech Industrial Development Zone.
Related Chiplet
- Optical Chiplet
- Reverse Gearbox Chiplet
- FlexGen Multi-Die Smart Network-on-Chip (NoC) IP
- Ncore Multi-Die Interconnect IP
- Integrated voltage regulator (IVR) chiplet
Related News
- Abacus Semiconductor and Aalto University Announce Research Cooperation on High-Speed Chiplet Interconnects
- BOS Semiconductors Signed Development Contract for ADAS Chiplet SoC with an European OEM
- Analogue Insight and Tetrivis Announce Joint Development of “Eurytion RFK1”, a UCIe based 12 nm Ka/Ku-Band RF Chiplet Transceiver
- Draper Joins Intel Foundry Chiplet Alliance to Support Development of Interoperable and Secure Chiplet Solutions
Latest News
- Amkor Technology and NVIDIA Advance Strategic Partnership for AI Infrastructure
- Siemens expands agentic AI collaboration to tackle 3D IC power and thermal challenges with NVIDIA
- Photon Bridge Raises €10M to Tackle AI’s Emerging Laser Bottleneck
- Abacus Semiconductor and Aalto University Announce Research Cooperation on High-Speed Chiplet Interconnects
- UK Launches Semiconductor Catapult to Strengthen Sovereign Capabilities in AI Hardware and Defence