Malaysia plans $100bn boost to power fabs, chiplets, leading edge logic

The government of Malaysia wants to attract $100bn of investment in power fabs, advanced chiplet packaging and leading edge logic over the next seven years

By Nick Flaherty, eeNews Europe (May 30, 2024)

The National Semiconductor Strategy (NSS) announced in Malaysia this week at Semicon SouthEast Asia has three phases, from boosting the existing power fabs to chiplet packaging and then building leading edge fabs for logic and memory. It is aiming to stimulate over $100bn of investment from $5bn of subsidies says prime minister Anwar Ibrahim, attracting investment that previously would have gone to China.

“Geopolitical dynamics aside, a robust multinational semiconductor production remains vital for humankind’s survival, particularly as we are running out of time in our climate action and risk mitigation. Today, I offer our nation as the most neutral and non-aligned location for semiconductor production, to help build a more secure and resilient global semiconductor supply chain,” he said.