JCET Delivers Silicon Photonics Engine Samples, Marks CPO Milestone

Shanghai, China, January 21, 2026  — JCET Group today announced a key milestone in co-packaged optics (CPO). The company has delivered customer samples of its silicon photonics engine developed on the XDFOI^® advanced packaging platform. The samples have successfully completed customer validation testing.

The rapid expansion of artificial intelligence and high-performance computing is driving demand for optical interconnects that offer higher bandwidth, lower latency, and improved energy efficiency. By bringing optical and electrical components closer together through advanced packaging, CPO provides a more compact and scalable approach to meeting the next wave of system-level performance requirements.

JCET has been accelerating its R&D efforts and collaborations in CPO, working with multiple customers and building an end-to-end solution offering supported by scalable manufacturing capacity. The newly delivered optical engine samples reflect JCET’s progress in translating advanced packaging innovation into customer-ready deliverables.

Enabled by XDFOI^® multidimensional heterogeneous integration, the optical engine architecture integrates photonic devices and logic silicon at high density within the package. This approach helps improve bandwidth and energy efficiency at the package level, reduces interconnect loss, and supports greater system scalability.

CPO is expected to play an important role across both scale-up and scale-out networking architectures and is widely viewed as a foundational technology for next-generation compute infrastructure. At the same time, continued collaboration across the silicon photonics value chain is strengthening the broader ecosystem, spanning design, manufacturing, packaging, testing, and system-level validation.

Looking ahead, broader CPO adoption will depend on sustained innovation across the industry. JCET will continue to increase investment in advanced packaging, with a focus on multidimensional heterogeneous integration and optical test capabilities, to support high-performance computing, data centers, and next-generation networking platforms.