Intel’s Embarrassment of Riches: Advanced Packaging
By Alan Patterson, EETimes | March 27, 2025
Intel Foundry has an embarrassment of riches: amid a shortage of advanced-packaging capacity, the company has excess supply.
The manufacturing unit of the largest U.S. chip company is welcoming TSMC customers to transfer their designs directly from TSMC’s CoWoS to Intel’s Foveros advanced packaging. Demand for 3D wafer-level packaging from Nvidia and a handful of companies making AI chips has exceeded the ability of top foundry TSMC to meet demand since last year.
Intel has built the capacity, but few have come so far because the company has not been promoting it, TechInsights vice chair Dan Hutcheson told EE Times.
To read the full article, click here
Related Chiplet
- Integrated voltage regulator (IVR) chiplet
- High-performance connectivity chiplets
- eFPGA Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
Related News
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Intel and Lens Technology Collaborate to Enable Advanced Semiconductor Packaging for the AI Era
- Tessolve and Intel Foundry Collaborate on Enablement for EMIB Advanced Packaging Technology
- Glass Core Substrates and Interposers for Advanced Packaging: Insights from the Intellectual Property Landscape
Latest News
- Point2 Completes $136M Series B Funding with Arm, LB Investment, and Maverick Silicon
- Multibeam Appoints Interim CFO Following $200M Funding Milestone
- Multibeam Signs $140 Million Letter of Intent with the U.S. Department of Commerce
- Credo to Contribute OmniConnect Scale-In Interconnect Solution to the Open Compute Project to Address AI Inference Memory Wall
- Silicon Box Ships 500M Units at High Yield, Expands Production Capacity for Panel-Level Packaging