Intel’s Embarrassment of Riches: Advanced Packaging
By Alan Patterson, EETimes | March 27, 2025
Intel Foundry has an embarrassment of riches: amid a shortage of advanced-packaging capacity, the company has excess supply.
The manufacturing unit of the largest U.S. chip company is welcoming TSMC customers to transfer their designs directly from TSMC’s CoWoS to Intel’s Foveros advanced packaging. Demand for 3D wafer-level packaging from Nvidia and a handful of companies making AI chips has exceeded the ability of top foundry TSMC to meet demand since last year.
Intel has built the capacity, but few have come so far because the company has not been promoting it, TechInsights vice chair Dan Hutcheson told EE Times.
To read the full article, click here
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related News
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Glass Core Substrates and Interposers for Advanced Packaging: Insights from the Intellectual Property Landscape
- Ayar Labs Welcomes Intel Veteran Pooya Tadayon as VP of Packaging and Test
- Biden-Harris Administration to Invest Up to $1.6 Billion to Establish and Accelerate Domestic Capacity Advanced Packaging
Latest News
- POET Technologies and Lumilens Advance Wafer-Level Photonic Integration for Next-Generation AI Optical Networks
- Tower Semiconductor Signs Customer Contracts for $1.3 Billion Silicon Photonics Revenue for 2027
- IC-Link by imec joins TSMC 3DFabric® Alliance to accelerate advanced packaging and 3D IC innovation
- EXTOLL announces Availability of Industry's first 16G UCIe PHY IP in GlobalFoundries 22FDX/22FDX+ Ready for Customer Integration
- NHanced Semiconductors & the University of Florida to Present on Hybrid Bonding Reliability at the 2026 Electronic Components & Technology Conference in Orlando