Intel’s Embarrassment of Riches: Advanced Packaging
By Alan Patterson, EETimes | March 27, 2025
Intel Foundry has an embarrassment of riches: amid a shortage of advanced-packaging capacity, the company has excess supply.
The manufacturing unit of the largest U.S. chip company is welcoming TSMC customers to transfer their designs directly from TSMC’s CoWoS to Intel’s Foveros advanced packaging. Demand for 3D wafer-level packaging from Nvidia and a handful of companies making AI chips has exceeded the ability of top foundry TSMC to meet demand since last year.
Intel has built the capacity, but few have come so far because the company has not been promoting it, TechInsights vice chair Dan Hutcheson told EE Times.
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