ForwardEdge ASIC Announces UCIe 3.0 IP Solution to Accelerate Next-Generation Chiplet-Based ASIC Innovation

Industry-leading UCIe 3.0 IP enables higher bandwidth, improved scalability, and faster integration for advanced heterogeneous semiconductor designs

St. Paul, Minnesota — October 14, 2026 — ForwardEdge ASIC, a leading provider of custom ASIC design and silicon solutions, today announced the availability of its new UCIe 3.0 IP solution, designed to help semiconductor companies, hyperscalers, AI innovators, and system developers accelerate the creation of next-generation chiplet-based devices.

As traditional monolithic SoC architectures hit complexity, cost, time-to-market and yield limits, die-to-die connectivity offers an essential path forward. ForwardEdge ASIC’s UCIe 3.0 IP delivers high-performance, low-latency interconnect capabilities while supporting heterogeneous integration across process nodes, IP vendors, and packaging technologies. By leveraging the UCIe ecosystem, customers can reduce development risk, accelerate product schedules, and optimize silicon performance for the most demanding workloads.

“The semiconductor industry is rapidly transitioning toward chiplet-based architectures as a foundation for future innovation,” said Frank Ferrante, CEO of ForwardEdge ASIC. “Our UCIe 3.0 IP gives design teams a proven path to build highly integrated ASIC solutions with greater scalability, performance, and design flexibility while reducing time-to-market and SoC complexity.”

Key Benefits of ForwardEdge ASIC UCIe 3.0 IP

• Silicon Proven: Proven on GlobalFoundries 12LP+ node.
• 100% Domestic Supply Chain: Developed, fabricated, assembled, and tested entirely with U.S. onshore resources.
• High Performance: High-bandwidth, ultra-low-latency die-to-die connectivity with optimized power efficiency.
• De-Risked Integration: Standards-based interoperability reducing development risk across heterogeneous package architectures.
• Target Applications: Optimized for AI accelerators, data center infrastructure, networking, storage, aerospace, defense, and edge computing.

“Our proven UCIe 3.0 IP empowers organizations to build differentiated products faster, leverage a growing chiplet ecosystem, and realize the full benefits of heterogeneous integration,” added Bill Jenkins, Chief Revenue Officer.

The ForwardEdge ASIC UCIe 3.0 IP is available immediately for customer engagements.

About ForwardEdge ASIC

ForwardEdge ASIC is a trusted U.S.-based semiconductor supplier delivering advanced ASIC products, intellectual property (IP), and engineering services for defense, government, and commercial markets. As a DMEA-trusted partner, ForwardEdge ASIC combines deep technical expertise with a highly cleared workforce, enabling customers to accelerate mission-critical innovation with confidence. Known for exceptional execution, ForwardEdge ASIC consistently delivers an industry-leading 87% first-pass ASIC success rate, significantly outperforming industry averages while reducing development risk, cost, and time to deployment.

Website: www.forwardedgeasic.com