Chiplets and Automotive Computing – Interview with Bart Placklé, Imec
Chiplet architectures are redefining the automotive industry. Imec’s Bart Placklé explains how modular design, interoperability, and ecosystem collaboration can help Europe regain leadership in high-performance vehicle computing.
By Benjamin Müller, Automotive Digital Transformation | November 4, 2025
With more than two decades of experience in automotive and semiconductor technology, Bart Placklé has shaped some of the most fundamental transformations in the industry – from infotainment consolidation and domain controller evolution to Intel’s early autonomous mobility programs. As Vice President Automotive at Imec, he now leads efforts to advance chiplet integration as a foundation for next-generation high-performance automotive computing.
At the Automotive Computing Conference 2025, Placklé will speak about the structural and economic limits of traditional SoC design and why open, interoperable chiplet ecosystems are the key to scalable, sovereign computing in Europe. In the run-up to the conference, we spoke with him about the technological and structural shifts driving the future of automotive computing.
To read the full article, click here
Related Chiplet
- Integrated voltage regulator (IVR) chiplet
- High-performance connectivity chiplets
- eFPGA Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
Related News
- Imec and EV Group demonstrate wafer-to-wafer hybrid bonding with 200nm interconnect pitch and record high overlay accuracy
- Chiplets and Heterogeneous Computing for Robotics Design
- Imec unlocks system-level III-V chiplet integration on Si-CMOS by advancing its 300mm RF silicon interposer platform with high-density MIMCAPs, passive modeling, and laser-assisted bonding
- Arteris Announces Collaboration with IC-Link by imec to Accelerate Next-Gen AI and HPC Silicon
Latest News
- Amkor Technology Announces Strategic Partnership with NVIDIA to Expand Advanced Packaging and Test for Next-Generation AI Infrastructure
- Synopsys Enables AMD Instinct™ MI455X GPU Design with Comprehensive Multi-Die Solution
- AI Data Centers Push Silicon Photonics Toward 300-mm Scale
- TYLsemi De-Risks Chiplets With New Business Model
- Cadence Introduces AuraStack AI Super Agent, the World’s First Agentic AI Platform for PCB and Advanced Packaging