€16m project to secure the chiplet supply chain in Europe
A German consortium is working on a €16m project to secure the supply chain for chiplets and boost final assembly in Europe. This is set to create new standards for chiplet assembly with secure elements and an end-to-end design flow.

The T4T project for ‘Distributed Manufacturing for Novel and Trustworthy Electronics’ includes leading manufacturers such as Bosch, X-Fab, Audi and Osram as well as researchers from various Fraunhofer Institutes.
The secure supply of electronic components is of growing strategic importance for Germany, as the relocation of chip making to non-European regions increases the vulnerability to the introduction of malware and espionage functions.
At the same time, the risk of intellectual property (IP) theft of circuit designs by third parties is also increasing, say researchers. So the project aims to add secure elements to chips and chiplets made in foundries in Asia with post-quantum encryption with assembly and encoding of the systems taking place in a trusted environment in Germany.
To read the full article, click here
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related News
- European Chiplet Innovation: APECS Pilot Line starts Operation in the Framework of the EU Chips Act
- CHASSIS: European mobility, semiconductor, and software heavyweights team up with research in joint initiative for automotive chiplet technology
- Advanced Packaging Driving New Collaboration Across Supply Chain
- Arm Chiplet System Architecture Makes New Strides in Accelerating the Evolution of Silicon
Latest News
- Xanadu and Tower Semiconductor Deepen Strategic Collaboration to Accelerate Photonic Quantum Hardware Innovation
- EV Group Unveils Next-Generation EVG®120 Resist Processing System for High-Volume Manufacturing
- CEA Demonstrates First Dynamically Routed Electro-Optical Router for Photonic Interposers
- Renesas Develops SoC Technologies for Automotive Multi-Domain ECUs Essential for the SDV Era
- Keysight Unveils 3D Interconnect Designer for Chiplet and 3DIC Advanced Package Designs