€16m project to secure the chiplet supply chain in Europe
A German consortium is working on a €16m project to secure the supply chain for chiplets and boost final assembly in Europe. This is set to create new standards for chiplet assembly with secure elements and an end-to-end design flow.

The T4T project for ‘Distributed Manufacturing for Novel and Trustworthy Electronics’ includes leading manufacturers such as Bosch, X-Fab, Audi and Osram as well as researchers from various Fraunhofer Institutes.
The secure supply of electronic components is of growing strategic importance for Germany, as the relocation of chip making to non-European regions increases the vulnerability to the introduction of malware and espionage functions.
At the same time, the risk of intellectual property (IP) theft of circuit designs by third parties is also increasing, say researchers. So the project aims to add secure elements to chips and chiplets made in foundries in Asia with post-quantum encryption with assembly and encoding of the systems taking place in a trusted environment in Germany.
To read the full article, click here
Related Chiplet
- eFPGA Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
Related News
- CHASSIS: European mobility, semiconductor, and software heavyweights team up with research in joint initiative for automotive chiplet technology
- Silicon Box Announces It Joins Imec Automotive Chiplet Program to Strengthen Chip Supply Chains for Next-Generation Vehicles
- European CHASSIS Program reaches major milestone in chiplet development
- Advanced Packaging Driving New Collaboration Across Supply Chain
Latest News
- SILITH and UMC Achieve Mass Production Milestone for Silicon Photonics
- As AI Moves from Training to Inference, Optics Moves Closer to the Chip
- Arteris Announces Collaboration with IC-Link by imec to Accelerate Next-Gen AI and HPC Silicon
- Asahi Kasei Adds New Slitting Facility for SUNFORT™ to Meet Growing Demand for Advanced Semiconductor Packaging
- ACCM Introduces Celeritas SMC: A Production-Ready, Silicon-Matched Core for Advanced Packaging