Chiplet Summit 2024 Focuses on Accelerating Generative AI
SAN DIEGO -- December 04, 2023----Generative AI is today’s biggest technology news, and Chiplet Summit is therefore making it the focus of the 2024 event at the Santa Clara Convention Center on February 6-8. The Tuesday superpanel features leading experts expressing their views on "How Can Chiplets Accelerate Generative AI?". The Wednesday plenary has Palo Alto Electron CEO Jawad Nasrullah presenting "Developing Chips for Tomorrow: You, Me, and ChatGPT®". A Thursday session offers an annual update on generative AI applications.
The Summit also offers major company keynotes, tutorials, panels, and paper sessions on subjects ranging from optimization to industry trends. An exhibit hall has key products from industry leaders.
"Chiplet Summit will help designers meet Generative AI’s challenges," said Chuck Sobey, Summit General Chair. "We invite everyone in the ecosystem to come learn about new technologies, discuss issues face-to-face, and set the direction for the industry."
To discuss exhibiting, contact:
Elizabeth Leventhal, Exhibit Sales Director
Elizabeth@ChipletSummit.com
+1.760.809.5755
About Chiplet Summit
Chiplet Summit, produced by Semper Technologies, showcases the mainstream applications, key technologies, and leading vendors that are driving the rapidly expanding chiplet market.
To learn more about the Summit, visit https://chipletsummit.com.
Related Chiplet
- Integrated voltage regulator (IVR) chiplet
- High-performance connectivity chiplets
- eFPGA Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
Related News
- Empower Semiconductor to Present at Chiplet Summit 2024 on Eliminating External Regulators in Chiplet Architectures
- Alphawave Semi ‘Redefines Connectivity’ in AI Hardware and Edge AI Summit 2024 Presentation on Chiplet Interconnects
- Alphawave Semi Taped-Out Industry Leading 64Gbps UCIe™ IP on TSMC 3nm for the IP Ecosystem, Unleashing Next Generation of AI Chiplet Connectivity
- Chiplet Summit 2026 to Spotlight AI Acceleration and Advanced Packaging
Latest News
- India’s OSAT-ATMP Build-Out: From Legacy Packages to 2.5D
- Nvidia’s Inference Pivot Reaches Rebellions in Korea
- AMD to Bring UCIe Connectivity to Select AMD Versal Adaptive SoCs
- TSMC’s HBM-Packaging Yield Issues Help Intel, Analysts Say
- Qnity Expands AI-Driven Advanced Packaging Capabilities with End-to-End Process Solutions