Breaking Boundaries: Chiplet Interconnects, SDVs & electronica 2024
On this episode of Embedded Insiders, Editor-in-Chief, Ken Briodagh, sits down with Patrick Soheili and Kevin Donnelly of Eliyan to highlight the company's new Chiplet Interconnect PHY at 64Gbps in 3nm Process. The multi-die interconnect evolution marches on and Eliyan is getting a lot of attention for its ability to deliver performance and bandwidth like this in either standard or advanced packaging.
To read the full article, click here
Related News
- Sarcina pioneers next-generation UCIe-A/S chiplet interconnects for AI systems
- How do UCIe and BoW interconnects support generative AI on chiplets?
- How can in-package optical interconnects enhance chiplet generative AI performance?
- How does UCIe on chiplets enable optical interconnects in data centers?
Latest News
- NLM Photonics and Spark Photonics Partner to Advance Organic Hybrid Solutions
- Marvell Announces Acquisition of Polariton Technologies, Advancing Optical Performance Scaling to 3.2T and Beyond
- Alchip to Showcase Advanced AI ASIC Technologies at TSMC 2026 Technology Symposium
- CEZAMAT Boosts Advanced Photonics R&D with State-of-the-Art UV Nanoimprint System from EV Group
- Pat Gelsinger joins Syenta's board as Playground Global and NRF lead A$37M raise