Chiplet-Based Solutions Accelerate the Development of Embedded NVM
By Maurizio Di Paolo Emilio, embedded.com | Oct 29, 2025
Deca Technologies and Silicon Storage Technology (SST), a subsidiary of Microchip Technology Inc., have announced a strategic collaboration to address the challenges of semiconductor integration through non-volatile memory (NVM) chiplet solutions. This partnership combines Deca’s M-Series fan-out and Adaptive Patterning technologies with SST’s SuperFlash embedded flash technology, creating what both companies describe as a comprehensive platform for modular, multi-die systems.
In an exclusive interview with Embedded.com, Dave Eggleston, Senior Business Development Manager at Microchip Licensing Division, will delve into the details and implications of the announced partnership.
To read the full article, click here
Related Chiplet
- FlexGen Multi-Die Smart Network-on-Chip (NoC) IP
- Ncore Multi-Die Interconnect IP
- Integrated voltage regulator (IVR) chiplet
- High-performance connectivity chiplets
- eFPGA Chiplet
Related News
- Xallent and MPI Announce Strategic Partnership to Innovate and Accelerate the Development of Next Generation AI Chips
- Imec and Tokyo Electron extend partnership to accelerate the development of beyond-2nm nodes
- EdgeCortix Joins AI-RAN Alliance to Accelerate the Integration of AI and Next-gen RAN Infrastructure
- AMI Brings Firmware Expertise to Arm Total Design Ecosystem to Simplify and Accelerate Development for Arm-based Custom Chiplet Solutions
Latest News
- Racyics UCIe PHY IP for GlobalFoundries 22FDX reaches silicon
- EdgeCortix Unveils RAIDEN, a Scalable, Energy-Efficient AI Chiplet Platform Purpose-Built for Physical AI
- Coherent Launches PhotonLink™ Integrated Optics Platform for AI Infrastructure
- AT&S and Marvell Technology expand collaboration to support next-generation AI infrastructure
- SMART Photonics Partners with GlobalFoundries to Offer Industry’s First Open Access Foundry Service for Integrated Silicon and Indium Phosphide Photonics Products