Chiplet-Based Solutions Accelerate the Development of Embedded NVM
By Maurizio Di Paolo Emilio, embedded.com | Oct 29, 2025
Deca Technologies and Silicon Storage Technology (SST), a subsidiary of Microchip Technology Inc., have announced a strategic collaboration to address the challenges of semiconductor integration through non-volatile memory (NVM) chiplet solutions. This partnership combines Deca’s M-Series fan-out and Adaptive Patterning technologies with SST’s SuperFlash embedded flash technology, creating what both companies describe as a comprehensive platform for modular, multi-die systems.
In an exclusive interview with Embedded.com, Dave Eggleston, Senior Business Development Manager at Microchip Licensing Division, will delve into the details and implications of the announced partnership.
To read the full article, click here
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related News
- Xallent and MPI Announce Strategic Partnership to Innovate and Accelerate the Development of Next Generation AI Chips
- Imec and Tokyo Electron extend partnership to accelerate the development of beyond-2nm nodes
- The Basics of Chiplet Integration and Importance of Adhesive Solutions
- Tenstorrent Expands Deployment of Arteris’ Network-on-Chip IP to Next-Generation of Chiplet-Based AI Solutions
Latest News
- Ayar Labs Closes $500M Series E, Accelerates Volume Production of Co-Packaged Optics
- NanoIC opens access to first-ever fine-pitch RDL and D2W hybrid bonding interconnect PDKs
- GUC Announces Tape-out of UCIe 64G IP on TSMC N3P Technology
- GLS and APES Announce Advanced Semiconductor Packaging Partnership
- Ayar Labs Names Sankara Venkateswaran as Vice President of Engineering