Cadence to Buy Artisan to Support Chiplet, 3D IC Future
By Yashasvini Razdan, EETimes | April 29, 2025

Cadence Design Systems has entered into a definitive agreement to acquire Arm’s Artisan Foundation IP business, complementing its AI and chiplet ambitions. This includes standard cell libraries, memory compilers, and GPIOs—components critical for advanced node SoCs and modular designs.
“With the addition of Arm’s Artisan IP, Cadence will enter the foundation IP market and support new growth across design services and chiplet offerings,” said Boyd Phelps, SVP and GM of the silicon solutions group at Cadence.
To read the full article, click here
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related News
- Cadence Accelerates SoC, 3D-IC and Chiplet Design for AI Data Centers, Automotive and Connectivity in Collaboration with Samsung Foundry
- TSMC Announces Breakthrough Set to Redefine the Future of 3D IC
- UMC Launches W2W 3D IC Project with Partners, Targeting Growth in Edge AI
- UMC Introduces Industry’s First 3D IC Solution for RFSOI, Accelerating Innovations in the 5G Era
Latest News
- Xanadu and Tower Semiconductor Deepen Strategic Collaboration to Accelerate Photonic Quantum Hardware Innovation
- EV Group Unveils Next-Generation EVG®120 Resist Processing System for High-Volume Manufacturing
- CEA Demonstrates First Dynamically Routed Electro-Optical Router for Photonic Interposers
- Renesas Develops SoC Technologies for Automotive Multi-Domain ECUs Essential for the SDV Era
- Keysight Unveils 3D Interconnect Designer for Chiplet and 3DIC Advanced Package Designs