Boom predicted for chiplet market
By Nick Flaherty, eeNews Europe (January 29, 2024)

The global chiplet market is set to grow at an annual rate of over 42% says a new report from Markets.us.
The research identified $3.1bn of revenue in the chiplet market in 2023, but all of this was withing single companies. Two thirds came from the launch of processors from Intel, AMD and Nvidia and the rest from networking devices from Marvell and high end FPGAs from AMD/Xilinx.
The chiplet market is expected to grow to $107.0bn by 2033, a CAGR compound growth of 42.5%, with $4.4bn predicted for this year.
Chiplets provide the flexibility to mix and match different blocks to cater to specific needs, making them ideal for a range of applications, from consumer electronics to high-performance computing and data centres say the analysts at Markets.us. The chiplets market is poised for significant growth, driven by various driving factors and opportunities. The increasing demand for advanced semiconductor solutions across multiple industries, including consumer electronics, automotive, telecommunications, data centers and AI, is a major driving factor.
To read the full article, click here
Related Chiplet
- FlexGen Multi-Die Smart Network-on-Chip (NoC) IP
- Ncore Multi-Die Interconnect IP
- Integrated voltage regulator (IVR) chiplet
- High-performance connectivity chiplets
- eFPGA Chiplet
Related News
- CHASSIS: European mobility, semiconductor, and software heavyweights team up with research in joint initiative for automotive chiplet technology
- Cadence Launches Partner Ecosystem to Accelerate Chiplet Time to Market
- NewPhotonics® Introduces Industry-First Serviceable Near-Packaged Optics (NPO) Chiplet Solution with Interoperability for 1.6T
- Keysight Unveils 3D Interconnect Designer for Chiplet and 3DIC Advanced Package Designs
Latest News
- SMART Photonics Partners with GlobalFoundries to Offer Industry’s First Open Access Foundry Service for Integrated Silicon and Indium Phosphide Photonics Products
- OpenLight Adds Former GlobalFoundries Silicon Photonics Leader Kevin Soukup and Semiconductor Veteran Kirk Ouellette to Executive Team
- Marvell to Showcase Industry-First 2nm Optical Technology Demos for AI Data Center Infrastructure at ECOC 2026
- AI Chip Packaging Pushes Beyond Reticle Limits, with CoWoS-L Set to Remain the Mainstream Advanced Packaging Solution Through 2028
- onsemi Introduces the Embedded Power Platform, a Breakthrough Architecture for the AI Era