Boom predicted for chiplet market
By Nick Flaherty, eeNews Europe (January 29, 2024)

The global chiplet market is set to grow at an annual rate of over 42% says a new report from Markets.us.
The research identified $3.1bn of revenue in the chiplet market in 2023, but all of this was withing single companies. Two thirds came from the launch of processors from Intel, AMD and Nvidia and the rest from networking devices from Marvell and high end FPGAs from AMD/Xilinx.
The chiplet market is expected to grow to $107.0bn by 2033, a CAGR compound growth of 42.5%, with $4.4bn predicted for this year.
Chiplets provide the flexibility to mix and match different blocks to cater to specific needs, making them ideal for a range of applications, from consumer electronics to high-performance computing and data centres say the analysts at Markets.us. The chiplets market is poised for significant growth, driven by various driving factors and opportunities. The increasing demand for advanced semiconductor solutions across multiple industries, including consumer electronics, automotive, telecommunications, data centers and AI, is a major driving factor.
To read the full article, click here
Related Chiplet
- Integrated voltage regulator (IVR) chiplet
- High-performance connectivity chiplets
- eFPGA Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
Related News
- Athos Spins Out Of Mercedes With Chiplet Concept for AVs
- Arteris Selected by 2V Systems for IO Chiplet for Data Center
- Baya Systems Accelerates Global Expansion with New U.K. Office for AI and Chiplet Innovation
- What could back an open market for chiplets?
Latest News
- Point2 Completes $136M Series B Funding with Arm, LB Investment, and Maverick Silicon
- Multibeam Appoints Interim CFO Following $200M Funding Milestone
- Multibeam Signs $140 Million Letter of Intent with the U.S. Department of Commerce
- Credo to Contribute OmniConnect Scale-In Interconnect Solution to the Open Compute Project to Address AI Inference Memory Wall
- Silicon Box Ships 500M Units at High Yield, Expands Production Capacity for Panel-Level Packaging