4 takeaways from the 2nd automotive chiplet conference
On October 10 and 11, 2023, the automotive ecosystem convened at imec to talk about what’s now routinely called ‘the chiplet challenge.’ Here are four takeaways from those two days.
1. Chiplets are on everyone’s radar
The number of participating companies had risen from 30 to 50 compared to the first installment of the automotive chiplet conference. It’s safe to say all these people didn’t fly in to enjoy the Belgian autumn weather. They were there because chiplets are a hot topic in the industry.
One participant said, “The question is not if but when chiplets will enter the automotive market.”
It’s a matter of logic: next-level ADAS and in-vehicle infotainment (IVI) features will require compute performance levels that are par with those of data centers or high-end consumer devices. And these markets have already moved to chiplets.
To read the full article, click here
Related Chiplet
- High Performance Droplet
- Interconnect Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Bridglets
- Automotive AI Accelerator
Related News
- BOS and Tenstorrent Unveil Eagle-N, Industry’s First Automotive AI Accelerator Chiplet SoC
- Automotive Chiplet Ecosystem Heralds Agility and Flexibility
- Brewer Science to Present Temporary Bonding Materials for Chiplet Integration at 2025 Critical Materials Council (CMC) Conference
- Alphawave Semi at the Forefront of PCIe® 7.0 Specification: Showcasing Next-Gen Chiplet Interoperability and Optical PCIe Technology at PCI-SIG® Developers Conference 2025
Latest News
- CoAsia SEMI Announces AI Chiplet Production Collaboration With Tenstorrent
- Cadence Launches Partner Ecosystem to Accelerate Chiplet Time to Market
- Ambiq and Bravechip Cut Smart Ring Costs by 85% with New Edge AI Chiplet
- TI accelerates the shift toward autonomous vehicles with expanded automotive portfolio
- Where co-packaged optics (CPO) technology stands in 2026