Meeting the Cleaning Challenges of High-density 3D Heterogeneous Integration Applications
By John Taddei, Veeco
3D InCites | August 04, 2025
Today’s rapid growth in 3D heterogeneous integration (3D HI) is being driven by a plethora of high-performance computing applications driving the microelectronics industry, including autonomous driving and artificial intelligence.
This strong need for 3D HI has pushed capital expenditures for advanced packaging at a remarkable pace. The advanced packaging market is projected to grow at a CAGR of 9.4% from 2024 to 2030 with a rise from more than $45B in 2024 to almost $80B by 2030, according to Yole.
These advancements required new process technology and process equipment to produce high density advanced packages with high yields. These backend devices are manufactured on 300mm wafers and require low defectivity levels that were previously restricted to front-end processes. As a result, new toolsets need to have low defectivity to obtain high yields, while delivering a low cost of ownership.
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