EXTOLL and Chip Interfaces introduce the Industry´s first Integrated UCIe IP Solution for GlobalFoundries FDX Technology

Mannheim, Germany -- May 22, 2026 — EXTOLL, a leading provider of high-speed and ultra-low-power SerDes and Chiplet connectivity, and Chip Interfaces, a leading supplier of digital IP cores are thrilled to offer the industry´s first integrated UCIe IP solution (PHY and D2D Adapter) for GlobalFoundries’ (GF) FDX™ technology.

The offering is customer-ready and integrates EXTOLL´s PHY and Chip Interfaces´ D2D Adapter as a co-verified platform to realize highly efficient end-to-end die-to-die connectivity tailored for mainstream technology nodes.

“Expanding on our highly successful alliance with Chip Interfaces, we are proud to introduce an advanced, timely solution. It eases and accelerates our customers' migration to chiplet architectures, ultimately enabling unprecedented levels of performance and innovation.” says Dirk Wieberneit, CEO of EXTOLL.

The IP is optimized for standard packaging, with full support for organic substrates across standard-defined bump pitch ranges. Designed and rigorously verified for interoperability, it empowers customers to develop differentiated systems based on the UCIe v2.0 standard.

The UCIe D2D Adapter is the intermediate layer between the Protocol and the UCIe PHY. Towards the protocol layer it exposes one or more Flit Aware Die to Die Interfaces (FDI), this interface can handle both Streaming data as well as Flit encoded data in various formats. As such, also Chip Interfaces’ latest JESD204E Controller will soon be available to add advanced connectivity to the combined UCIe interface solution. Towards the UCIe PHY it uses the Raw Die to Die interface (RDI).

“The D2D Adapter for UCIe and the UCIe PHY deliver a fully integrated, end-to-end UCIe solution. The D2D Adapter from Chip Interfaces and the UCIe PHY from Extoll integrated into a single, cohesive package.

At Chip Interfaces, we are excited about extending our collaboration with Extoll in advancing UCIe technology, which enabling us to provide our customers with a comprehensive, production-ready solution,” says Anne Voss Winther, CEO of Chip Interfaces.

The addressable market is broad, spanning Edge AI, Physical AI, robotics, aerospace and defense, as well as medical and automotive applications.

EXTOLL brings deep expertise in die-to-die connectivity. Its UCIe IP is a key building block for highly efficient chiplet-based architectures, complementing EXTOLL’s extensible Network-on-Chip (NoC) and SerDes IP portfolio.

About EXTOLL

EXTOLL, a leading supplier of high-speed and ultra-low power SerDes and Chiplet connectivity, designs and develops semiconductor IP with the smallest footprints and highest PPA in the industry, serving the worldwide market of ASIC, SoC- and Chiplet-Makers in various segments. The portfolio provides customers with tailored solutions for their systems covering NoC (Network-on-Chip) and Die-to-Die interfaces.EXTOLL delivers innovative solutions to enable customers to successfully migrate into the Chiplet Age.

Find out more about our products and solutions – please visit us at www.extoll.com

About Chip Interfaces

Chip Interfaces is a leading provider of silicon-agnostic, customizable digital IP cores for next-generation applications. Its portfolio includes JESD204, MIPI, Interlaken, UCIe D2D, UAlink, DiFi, CPRI/eCPRI, and High-Speed Ethernet solutions, including MAC, PCS, and MACsec.

Through advanced verification, interoperability testing with leading PHY providers, and test-bed validation, Chip Interfaces helps customers simplify integration, reduce design risk, and accelerate time to market.

Find out more about our products and solutions – please visit us at www.chipinterfaces.com