Achronix Semiconductor Corp - Chiplet Ecosystem

Achronix Semiconductor Corporation is a fabless semiconductor corporation based in Santa Clara, California, offering high-performance FPGA solutions. Achronix is the only supplier to have both high-performance and high-density standalone FPGAs and embedded FPGA (eFPGA) solutions in high-volume production. Achronix's FPGA and eFPGA IP offerings are further enhanced by ready-to-use PCIe accelerator cards targeting AI, ML, networking and data center applications. All of Achronix's products are supported by best-in-class EDA software tools.

Chiplets Built with Speedcore eFPGA IP

Speedcore™ eFPGA IP can be deployed in various form factors including being integrated into a customer-defined chiplet that can be deployed in a system-in-package (SiP) solution via 2.5D interconnect technology. The following figures show three options for the SiP integration. The first is based on an organic substrate providing the lowest cost but does not provide the highest interconnect density between the die. Redistribution layer (RDL) based interposers are the next step in interconnect density but are also more expensive. Finally, silicon-based interposers provide the most interconnect density and compatibility with high-bandwidth memory (HBM), but come at the highest cost.

Chiplet solutions allow designers to reduce the board space required and realize new integration possibilities compared to a standalone FPGA solution. With a custom Speedcore eFPGA IP-based chiplet solution, designers need to specify the interconnect technology between the chiplet and their ASIC die. Speedcore eFPGA IP is agnostic as to the chiplet interconnect technology and has the interconnect density and performance to work with all the various 2.5D interconnects. Designers can fully customize the amount of logic, DSP blocks, and memory in the Speedcore eFPGA to match their application requirements.