High-Density Electronic-Photonic Chiplet
- Parallel electrical interface
- Supports AIB and other proprietary parallel interfaces
- 8 full-duplex optical ports
Chiplet Marketplace
Chiplet Marketplace is the world's most comprehensive Chiplet resource with over 200 Chiplets from 20 vendors and foundries
Highlights
New Chiplet
UCIe AP based 8-bit 170-Gsps Chiplet Transceiver
- 2T2R chiplet configuration
- 160/175-GSa/s sample rate
- 7-bit resolution
UCIe based 8-bit 48-Gsps Transceiver
- 48-Gsps peak sample rate
- 8 bit resolution
- UCIe SP (16x lanes at 16Gbps) with streaming controller
UCIe based 12-bit 12-Gsps Transceiver
- 12-Gsps peak sample rate
- 12 bit resolution (programmable)
- UCIe SP (16x lanes at 16Gbps) with streaming controller
Parallel Single Mode (PSM) 16-channel 112 Gbps Transmitter Chiplet
- 16x DR4 specification compliant transmit channels including modulator and driver
- Digital SPI control interface
Active silicon interposer
- Network-On-Interposer
- 4 Tbps aggregate bisection bandwidth
100G optical I/O chiplets
- RANOVUS®’ Odin® optical I/O cores set industry benchmarks for high bandwidth, low power consumption and small size for AI, cloud, metaverse, and communications applications
Memory Chiplet
- Stealth Mode Products design to disrupt AI/Generative AI processing.
Transceiver Chiplet
- Die-level transceiver products with AIB or SerDes interfaces
Featured News
Outlook 2025: Embracing the chiplet journey
2024-10-17T14:00:00+02:00
Chiplet market to hit US$411B by 2035, transforming semiconductor industry
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Xscape Photonics Raises $44 Million Series A to Reimagine the AI Data Center
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Recent News
Commentary / Analysis
Outlook 2025: Embracing the chiplet journey
2024-10-17T14:00:00+02:00
Commentary / Analysis
Chiplet market to hit US$411B by 2035, transforming semiconductor industry
2024-10-17T08:34:00+02:00
Business
Chiplet
Business
Xscape Photonics Raises $44 Million Series A to Reimagine the AI Data Center
2024-10-16T07:15:00+02:00
Chiplet
Arm Total Design Ignites Growing Ecosystem of Arm-based Silicon for a Sustainable AI Datacenter
2024-10-16T06:59:00+02:00
Chiplet
ADTechnology Partners with Arm, Samsung Foundry, and Rebellions on AI CPU Chiplet Platform
2024-10-16T06:51:00+02:00
Chiplet Enablers
Berkeley Lab and Open Compute Project Collaborate to Advance Chiplet Technology for HPC
2024-10-16T06:23:00+02:00
IP
Egis Group Announces Strategic Collaboration with Arm to Drive AI HPC Chip Technology Innovation
2024-10-16T04:51:00+02:00
Packages
KLA Unveils Comprehensive IC Substrate Portfolio for a New Era of Advanced Semiconductor Packaging
2024-10-16T02:30:00+02:00
Chiplet
Alchip Reveals 3DIC Design Optimization Keys
2024-10-15T17:45:00+02:00
Business
Chiplet
Eliyan Delivers Industry’s Highest Performing Chiplet Interconnect PHY at 64Gbps in 3nm Process
2024-10-10T07:02:00+02:00
Commentary / Analysis
Ayar CEO: ‘Copper Is Already Broken; Agentic AI Will Require Optical I/O’
2024-10-09T06:58:00+02:00
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Faraday and Kiwimoore Succeed in 2.5D Packaging Project for Mass Production
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Other
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2024-10-03T15:14:00+02:00
Business
Commentary / Analysis
Global Semiconductor Packaging Material Market Outlook Shows Return to Growth Starting in 2024
2024-10-03T13:23:00+02:00
Commentary / Analysis
Partitioning In The Chiplet Era
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Chiplet Enablers
CEA-Leti Develops Active Optical Interposers to Connect Chiplets
2024-10-02T07:10:00+02:00
Packages
MRSI Mycronic introduces next generation high precision epoxy dispenser for advanced packaging
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IP
Commentary / Analysis
Barriers To Chiplet Sockets
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Commentary / Analysis
EDA
EDA
Synopsys and TSMC Pave the Path for Trillion-Transistor AI and Multi-Die Chip Design
2024-09-26T06:54:00+02:00
Event
IP
GUC Announces Adoption of HBM3E IP by CSP Data Center
2024-09-24T11:40:00+02:00
Technical Papers
MFIT : Multi-FIdelity Thermal Modeling for 2.5D and 3D Multi-Chiplet Architectures
October 17, 2024
Complex Heterogeneous Integration Drives Innovation In Semiconductor Test
October 15, 2024
The Evolution of Photonic Integrated Circuits and Silicon Photonics
October 7, 2024
Flexible electronic-photonic 3D integration from ultrathin polymer chiplets
October 2, 2024
Outlook 2025: Embracing the chiplet journey
2024-10-17T14:00:00+02:00
Chiplet market to hit US$411B by 2035, transforming semiconductor industry
2024-10-17T08:34:00+02:00
Xscape Photonics Raises $44 Million Series A to Reimagine the AI Data Center
2024-10-16T07:15:00+02:00
Commentary / Analysis
Outlook 2025: Embracing the chiplet journey
2024-10-17T14:00:00+02:00
Commentary / Analysis
Chiplet market to hit US$411B by 2035, transforming semiconductor industry
2024-10-17T08:34:00+02:00
Business
Chiplet
Business
Xscape Photonics Raises $44 Million Series A to Reimagine the AI Data Center
2024-10-16T07:15:00+02:00
Chiplet
Arm Total Design Ignites Growing Ecosystem of Arm-based Silicon for a Sustainable AI Datacenter
2024-10-16T06:59:00+02:00
Chiplet
ADTechnology Partners with Arm, Samsung Foundry, and Rebellions on AI CPU Chiplet Platform
2024-10-16T06:51:00+02:00
Chiplet Enablers
Berkeley Lab and Open Compute Project Collaborate to Advance Chiplet Technology for HPC
2024-10-16T06:23:00+02:00
IP
Egis Group Announces Strategic Collaboration with Arm to Drive AI HPC Chip Technology Innovation
2024-10-16T04:51:00+02:00
Packages
KLA Unveils Comprehensive IC Substrate Portfolio for a New Era of Advanced Semiconductor Packaging
2024-10-16T02:30:00+02:00
Chiplet
Alchip Reveals 3DIC Design Optimization Keys
2024-10-15T17:45:00+02:00
Business
Chiplet
Eliyan Delivers Industry’s Highest Performing Chiplet Interconnect PHY at 64Gbps in 3nm Process
2024-10-10T07:02:00+02:00
Commentary / Analysis
Ayar CEO: ‘Copper Is Already Broken; Agentic AI Will Require Optical I/O’
2024-10-09T06:58:00+02:00
Chiplet
Faraday and Kiwimoore Succeed in 2.5D Packaging Project for Mass Production
2024-10-08T08:39:00+02:00
Other
Hybrid bonding: A global picture of the IP competition
2024-10-07T10:15:00+02:00
Packages
Amkor and TSMC to Expand Partnership and Collaborate on Advanced Packaging in Arizona
2024-10-04T06:49:00+02:00
EDA
Faraday Enhances 3D-IC Design Service with Ansys Multiphysics Analysis
2024-10-03T15:14:00+02:00
Business
Commentary / Analysis
Global Semiconductor Packaging Material Market Outlook Shows Return to Growth Starting in 2024
2024-10-03T13:23:00+02:00
Commentary / Analysis
Partitioning In The Chiplet Era
2024-10-03T12:27:00+02:00
Chiplet Enablers
CEA-Leti Develops Active Optical Interposers to Connect Chiplets
2024-10-02T07:10:00+02:00
Packages
MRSI Mycronic introduces next generation high precision epoxy dispenser for advanced packaging
2024-10-01T07:48:00+02:00
IP
Commentary / Analysis
Barriers To Chiplet Sockets
2024-09-30T08:48:00+02:00
Commentary / Analysis
EDA
EDA
Synopsys and TSMC Pave the Path for Trillion-Transistor AI and Multi-Die Chip Design
2024-09-26T06:54:00+02:00
Event
IP
GUC Announces Adoption of HBM3E IP by CSP Data Center
2024-09-24T11:40:00+02:00
Technical Papers
MFIT : Multi-FIdelity Thermal Modeling for 2.5D and 3D Multi-Chiplet Architectures
October 17, 2024
Complex Heterogeneous Integration Drives Innovation In Semiconductor Test
October 15, 2024
The Evolution of Photonic Integrated Circuits and Silicon Photonics
October 7, 2024
Flexible electronic-photonic 3D integration from ultrathin polymer chiplets
October 2, 2024