High-Density Electronic-Photonic Chiplet Parallel electrical interface Supports AIB and other proprietary parallel interfaces 8 full-duplex optical ports Learn more
UCIe AP based 8-bit 170-Gsps Chiplet Transceiver 2T2R chiplet configuration 160/175-GSa/s sample rate 7-bit resolution Learn more
UCIe based 8-bit 48-Gsps Transceiver 48-Gsps peak sample rate 8 bit resolution UCIe SP (16x lanes at 16Gbps) with streaming controller Learn more
UCIe based 12-bit 12-Gsps Transceiver 12-Gsps peak sample rate 12 bit resolution (programmable) UCIe SP (16x lanes at 16Gbps) with streaming controller Learn more
Parallel Single Mode (PSM) 16-channel 112 Gbps Transmitter Chiplet 16x DR4 specification compliant transmit channels including modulator and driver Digital SPI control interface Learn more
100G optical I/O chiplets RANOVUS®’ Odin® optical I/O cores set industry benchmarks for high bandwidth, low power consumption and small size for AI, cloud, metaverse, and communications applications Learn more
Arm, ASE, BMW Group, Bosch, Cadence, Siemens, SiliconAuto, Synopsys, Tenstorrent and Valeo commit to join imec’s Automotive Chiplet Program 2024-10-11T06:29:00+02:00
Eliyan Delivers Industry’s Highest Performing Chiplet Interconnect PHY at 64Gbps in 3nm Process 2024-10-10T07:02:00+02:00
Faraday and Kiwimoore Succeed in 2.5D Packaging Project for Mass Production 2024-10-08T08:39:00+02:00
Business Arm, ASE, BMW Group, Bosch, Cadence, Siemens, SiliconAuto, Synopsys, Tenstorrent and Valeo commit to join imec’s Automotive Chiplet Program 2024-10-11T06:29:00+02:00
Chiplet Eliyan Delivers Industry’s Highest Performing Chiplet Interconnect PHY at 64Gbps in 3nm Process 2024-10-10T07:02:00+02:00
Commentary / Analysis Ayar CEO: ‘Copper Is Already Broken; Agentic AI Will Require Optical I/O’ 2024-10-09T06:58:00+02:00
Chiplet Faraday and Kiwimoore Succeed in 2.5D Packaging Project for Mass Production 2024-10-08T08:39:00+02:00
Packages Amkor and TSMC to Expand Partnership and Collaborate on Advanced Packaging in Arizona 2024-10-04T06:49:00+02:00
Business Rapidus establishes state-of-the-art back-end semiconductor manufacturing process research-and-development center 2024-10-03T14:55:00+02:00
Commentary / Analysis Global Semiconductor Packaging Material Market Outlook Shows Return to Growth Starting in 2024 2024-10-03T13:23:00+02:00
Chiplet Enablers CEA-Leti Develops Active Optical Interposers to Connect Chiplets 2024-10-02T07:10:00+02:00
Packages MRSI Mycronic introduces next generation high precision epoxy dispenser for advanced packaging 2024-10-01T07:48:00+02:00
IP Unveiling the Availability of Industry’s First Silicon-Proven 3nm, 24Gbps UCIe™ IP Subsystem with TSMC CoWoS® Technology 2024-09-30T13:02:00+02:00
Commentary / Analysis Global Semiconductor Industry Plans to Invest $400 Billion in 300mm Fab Equipment Over Next Three Years, SEMI Reports 2024-09-26T14:08:00+02:00
EDA TSMC and Cadence Collaborate to Deliver AI-Driven Advanced-Node Design Flows, Silicon-Proven IP and 3D-IC Solutions 2024-09-26T07:59:00+02:00
EDA Synopsys and TSMC Pave the Path for Trillion-Transistor AI and Multi-Die Chip Design 2024-09-26T06:54:00+02:00
Event Alphawave Semi and Arm to Present on Chiplets for Architecting Next-Generation Terabit AI Networks at the TSMC OIP Ecosystem Forum North America 2024-09-25T06:16:00+02:00
People Sehat Sutardja, Marvell co-founder, chiplet pioneer has died, aged 63 2024-09-23T12:11:00+02:00
Event Avicena Demonstrates 30m Reach of microLED-based LightBundle Technology at European Conference on Optical Communications 2024-09-23T07:49:00+02:00
Commentary / Analysis Advanced Packaging Drives New Memory Solutions for the AI Era 2024-09-19T13:09:00+02:00
Commentary / Analysis Optical Chiplet Interconnect Promises to Accelerate Computing Apps 2024-09-18T08:58:00+02:00
Commentary / Analysis Safety architecture boosts automotive GPU for chiplets 2024-09-17T13:19:00+02:00
IP Enosemi and GlobalFoundries announce the availability of silicon-validated electronic-photonic design IP available in the GF Fotonix platform 2024-09-17T08:11:00+02:00
People SkyWater Names Bassel Haddad as Sr. Vice President and General Manager of Advanced Packaging 2024-09-16T14:13:00+02:00
Event MSquare Technology Showcases Leadership in IP and Chiplet Innovation at the AI Hardware & Edge AI Summit 2024-09-16T07:32:00+02:00
Complex Heterogeneous Integration Drives Innovation In Semiconductor Test By Jeorge Hurtarte, Teradyne October 15, 2024
The Evolution of Photonic Integrated Circuits and Silicon Photonics By Xiaoxi He, IDTechEx October 7, 2024
Flexible electronic-photonic 3D integration from ultrathin polymer chiplets By Yunxiang Huang, Thayer School of Engineering, Dartmouth College, Hanover, NH, USA October 2, 2024
Enabling Innovative Multi-Vendor Chiplet-Based Designs By Elad Alon, Blue Cheetah Analog Design September 27, 2024