Direct Chiplet Interface
- This device will enable CrossFire customers that have integrated DCI connectivity into their Chiplets to connect to Chiplets equipped with the standard high power, low density UCIe interface.
Chiplet Marketplace
Chiplet Marketplace is the world's most comprehensive Chiplet resource with over 200 Chiplets from 20 vendors and foundries
Highlights
New Chiplet
HBM3e Advanced-packaging chiplet for all workloads
- Scalable AI, fortified with high compute density and ample memory bandwidth
High-Density Electronic-Photonic Chiplet
- Parallel electrical interface
- Supports AIB and other proprietary parallel interfaces
- 8 full-duplex optical ports
UCIe AP based 8-bit 170-Gsps Chiplet Transceiver
- 2T2R chiplet configuration
- 160/175-GSa/s sample rate
- 7-bit resolution
UCIe based 8-bit 48-Gsps Transceiver
- 48-Gsps peak sample rate
- 8 bit resolution
- UCIe SP (16x lanes at 16Gbps) with streaming controller
UCIe based 12-bit 12-Gsps Transceiver
- 12-Gsps peak sample rate
- 12 bit resolution (programmable)
- UCIe SP (16x lanes at 16Gbps) with streaming controller
Parallel Single Mode (PSM) 16-channel 112 Gbps Transmitter Chiplet
- 16x DR4 specification compliant transmit channels including modulator and driver
- Digital SPI control interface
Active silicon interposer
- Network-On-Interposer
- 4 Tbps aggregate bisection bandwidth
100G optical I/O chiplets
- RANOVUS®’ Odin® optical I/O cores set industry benchmarks for high bandwidth, low power consumption and small size for AI, cloud, metaverse, and communications applications
Memory Chiplet
- Stealth Mode Products design to disrupt AI/Generative AI processing.
Featured News
Eliyan Ports Industry’s Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
2024-11-20T15:22:00+01:00
One Chip Vs. Many Chiplets
2024-11-20T10:59:00+01:00
Cadence Unveils Arm-Based System Chiplet
2024-11-20T08:13:00+01:00
Chiplets: Revolutionizing Semiconductor Design and Manufacturing
2024-11-19T11:15:00+01:00
Recent News
Chiplet
Foundries
Commentary / Analysis
One Chip Vs. Many Chiplets
2024-11-20T10:59:00+01:00
Chiplet
Cadence Unveils Arm-Based System Chiplet
2024-11-20T08:13:00+01:00
Commentary / Analysis
Chiplets: Revolutionizing Semiconductor Design and Manufacturing
2024-11-19T11:15:00+01:00
Other
Photonics
Lightmatter and Amkor Technology Partner to Build World’s Largest 3D Photonics Package
2024-11-14T18:49:00+01:00
Photonics
Lightmatter and ASE Partner to Bring 3D Photonics to Market
2024-11-14T18:41:00+01:00
Commentary / Analysis
Breaking Boundaries: Chiplet Interconnects, SDVs & electronica 2024
2024-11-14T15:44:00+01:00
Commentary / Analysis
The Evolution of Interconnects in Microelectronics Packaging
2024-11-14T14:17:00+01:00
Commentary / Analysis
Why tiny chiplets matter in the AI compute frenzy
2024-11-14T13:02:00+01:00
Other
Ayar Labs to Showcase the Future of AI Infrastructure with Fujitsu, Intel Foundry, Corning, and Altera
2024-11-13T16:41:00+01:00
Chiplet
Chiplet
REBEL™ and Beyond — Towards a Unified Chiplet Ecosystem
2024-11-13T07:49:00+01:00
Chiplet
Commentary / Analysis
A shift to photonics for data center networks and AI is underway
2024-11-08T08:13:00+01:00
Packages
ISE Labs Investment Secures the Establishment of New Site for Semiconductor Packaging and Test in Mexico
2024-11-08T08:05:00+01:00
Business
Business
Business
NAPMP announces chiplets R&D area
2024-11-06T07:59:00+01:00
Deals
Commentary / Analysis
Arm's Data Center Advances: Chiplets, Efficiency & AI Integration
2024-11-05T10:17:00+01:00
Commentary / Analysis
Chiplets Make Progress Using Interconnects As Glue
2024-10-31T13:44:00+01:00
Business
Commentary / Analysis
Silicon Photonics Set for Takeoff
2024-10-30T14:07:00+01:00
Commentary / Analysis
Intel patents chiplet GPU design
2024-10-30T13:52:00+01:00
Commentary / Analysis
HBM5 20hi Stack to Adopt Hybrid Bonding Technology, Potentially Transforming Business Models
2024-10-30T13:44:00+01:00
Commentary / Analysis
imec: New Methods for 2.5D and 3D Integration
2024-10-30T12:49:00+01:00
Commentary / Analysis
Hybrid Bonding Makes Strides Toward Manufacturability
2024-10-28T13:16:00+01:00
Other
BoS Semiconductors joins UCIe Consortium for its ADAS chiplet SoC family
2024-10-28T10:47:00+01:00
Technical Papers
Spiking Transformer Hardware Accelerators in 3D Integration
November 14, 2024
GATE-SiP: Enabling Authenticated Encryption Testing in Systems-in-Package
November 13, 2024
AIG-CIM: A Scalable Chiplet Module with Tri-Gear Heterogeneous Compute-in-Memory for Diffusion Acceleration
November 13, 2024
Chiplever: Towards Effortless Extension of Chiplet-based System for FHE
November 11, 2024
Eliyan Ports Industry’s Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
2024-11-20T15:22:00+01:00
One Chip Vs. Many Chiplets
2024-11-20T10:59:00+01:00
Cadence Unveils Arm-Based System Chiplet
2024-11-20T08:13:00+01:00
Chiplets: Revolutionizing Semiconductor Design and Manufacturing
2024-11-19T11:15:00+01:00
Chiplet
Foundries
Commentary / Analysis
One Chip Vs. Many Chiplets
2024-11-20T10:59:00+01:00
Chiplet
Cadence Unveils Arm-Based System Chiplet
2024-11-20T08:13:00+01:00
Commentary / Analysis
Chiplets: Revolutionizing Semiconductor Design and Manufacturing
2024-11-19T11:15:00+01:00
Other
Photonics
Lightmatter and Amkor Technology Partner to Build World’s Largest 3D Photonics Package
2024-11-14T18:49:00+01:00
Photonics
Lightmatter and ASE Partner to Bring 3D Photonics to Market
2024-11-14T18:41:00+01:00
Commentary / Analysis
Breaking Boundaries: Chiplet Interconnects, SDVs & electronica 2024
2024-11-14T15:44:00+01:00
Commentary / Analysis
The Evolution of Interconnects in Microelectronics Packaging
2024-11-14T14:17:00+01:00
Commentary / Analysis
Why tiny chiplets matter in the AI compute frenzy
2024-11-14T13:02:00+01:00
Other
Ayar Labs to Showcase the Future of AI Infrastructure with Fujitsu, Intel Foundry, Corning, and Altera
2024-11-13T16:41:00+01:00
Chiplet
Chiplet
REBEL™ and Beyond — Towards a Unified Chiplet Ecosystem
2024-11-13T07:49:00+01:00
Chiplet
Commentary / Analysis
A shift to photonics for data center networks and AI is underway
2024-11-08T08:13:00+01:00
Packages
ISE Labs Investment Secures the Establishment of New Site for Semiconductor Packaging and Test in Mexico
2024-11-08T08:05:00+01:00
Business
Business
Business
NAPMP announces chiplets R&D area
2024-11-06T07:59:00+01:00
Deals
Commentary / Analysis
Arm's Data Center Advances: Chiplets, Efficiency & AI Integration
2024-11-05T10:17:00+01:00
Commentary / Analysis
Chiplets Make Progress Using Interconnects As Glue
2024-10-31T13:44:00+01:00
Business
Commentary / Analysis
Silicon Photonics Set for Takeoff
2024-10-30T14:07:00+01:00
Commentary / Analysis
Intel patents chiplet GPU design
2024-10-30T13:52:00+01:00
Commentary / Analysis
HBM5 20hi Stack to Adopt Hybrid Bonding Technology, Potentially Transforming Business Models
2024-10-30T13:44:00+01:00
Commentary / Analysis
imec: New Methods for 2.5D and 3D Integration
2024-10-30T12:49:00+01:00
Commentary / Analysis
Hybrid Bonding Makes Strides Toward Manufacturability
2024-10-28T13:16:00+01:00
Other
BoS Semiconductors joins UCIe Consortium for its ADAS chiplet SoC family
2024-10-28T10:47:00+01:00
Technical Papers
Spiking Transformer Hardware Accelerators in 3D Integration
November 14, 2024
GATE-SiP: Enabling Authenticated Encryption Testing in Systems-in-Package
November 13, 2024
AIG-CIM: A Scalable Chiplet Module with Tri-Gear Heterogeneous Compute-in-Memory for Diffusion Acceleration
November 13, 2024
Chiplever: Towards Effortless Extension of Chiplet-based System for FHE
November 11, 2024