High-Density Electronic-Photonic Chiplet
- Parallel electrical interface
- Supports AIB and other proprietary parallel interfaces
- 8 full-duplex optical ports
Chiplet Marketplace
Chiplet Marketplace is the world's most comprehensive Chiplet resource with over 200 Chiplets from 20 vendors and foundries
Highlights
New Chiplet
UCIe AP based 8-bit 170-Gsps Chiplet Transceiver
- 2T2R chiplet configuration
- 160/175-GSa/s sample rate
- 7-bit resolution
UCIe based 8-bit 48-Gsps Transceiver
- 48-Gsps peak sample rate
- 8 bit resolution
- UCIe SP (16x lanes at 16Gbps) with streaming controller
UCIe based 12-bit 12-Gsps Transceiver
- 12-Gsps peak sample rate
- 12 bit resolution (programmable)
- UCIe SP (16x lanes at 16Gbps) with streaming controller
Parallel Single Mode (PSM) 16-channel 112 Gbps Transmitter Chiplet
- 16x DR4 specification compliant transmit channels including modulator and driver
- Digital SPI control interface
Active silicon interposer
- Network-On-Interposer
- 4 Tbps aggregate bisection bandwidth
100G optical I/O chiplets
- RANOVUS®’ Odin® optical I/O cores set industry benchmarks for high bandwidth, low power consumption and small size for AI, cloud, metaverse, and communications applications
Memory Chiplet
- Stealth Mode Products design to disrupt AI/Generative AI processing.
Transceiver Chiplet
- Die-level transceiver products with AIB or SerDes interfaces
Featured News
Alchip Reveals 3DIC Design Optimization Keys
2024-10-15T17:45:00+02:00
Eliyan Delivers Industry’s Highest Performing Chiplet Interconnect PHY at 64Gbps in 3nm Process
2024-10-10T07:02:00+02:00
Ayar CEO: ‘Copper Is Already Broken; Agentic AI Will Require Optical I/O’
2024-10-09T06:58:00+02:00
Faraday and Kiwimoore Succeed in 2.5D Packaging Project for Mass Production
2024-10-08T08:39:00+02:00
Recent News
Chiplet
Alchip Reveals 3DIC Design Optimization Keys
2024-10-15T17:45:00+02:00
Business
Chiplet
Eliyan Delivers Industry’s Highest Performing Chiplet Interconnect PHY at 64Gbps in 3nm Process
2024-10-10T07:02:00+02:00
Commentary / Analysis
Ayar CEO: ‘Copper Is Already Broken; Agentic AI Will Require Optical I/O’
2024-10-09T06:58:00+02:00
Chiplet
Faraday and Kiwimoore Succeed in 2.5D Packaging Project for Mass Production
2024-10-08T08:39:00+02:00
Other
Hybrid bonding: A global picture of the IP competition
2024-10-07T10:15:00+02:00
Packages
Amkor and TSMC to Expand Partnership and Collaborate on Advanced Packaging in Arizona
2024-10-04T06:49:00+02:00
EDA
Faraday Enhances 3D-IC Design Service with Ansys Multiphysics Analysis
2024-10-03T15:14:00+02:00
Business
Commentary / Analysis
Global Semiconductor Packaging Material Market Outlook Shows Return to Growth Starting in 2024
2024-10-03T13:23:00+02:00
Commentary / Analysis
Partitioning In The Chiplet Era
2024-10-03T12:27:00+02:00
Chiplet Enablers
CEA-Leti Develops Active Optical Interposers to Connect Chiplets
2024-10-02T07:10:00+02:00
Packages
MRSI Mycronic introduces next generation high precision epoxy dispenser for advanced packaging
2024-10-01T07:48:00+02:00
IP
Commentary / Analysis
Barriers To Chiplet Sockets
2024-09-30T08:48:00+02:00
Commentary / Analysis
EDA
EDA
Synopsys and TSMC Pave the Path for Trillion-Transistor AI and Multi-Die Chip Design
2024-09-26T06:54:00+02:00
Event
IP
GUC Announces Adoption of HBM3E IP by CSP Data Center
2024-09-24T11:40:00+02:00
Commentary / Analysis
Optimizing Wafer Edge Processes For Chip Stacking
2024-09-23T12:34:00+02:00
People
Sehat Sutardja, Marvell co-founder, chiplet pioneer has died, aged 63
2024-09-23T12:11:00+02:00
Event
Commentary / Analysis
Advanced Packaging Drives New Memory Solutions for the AI Era
2024-09-19T13:09:00+02:00
Commentary / Analysis
What Comes After HBM For Chiplets
2024-09-18T09:10:00+02:00
Commentary / Analysis
Optical Chiplet Interconnect Promises to Accelerate Computing Apps
2024-09-18T08:58:00+02:00
Commentary / Analysis
Safety architecture boosts automotive GPU for chiplets
2024-09-17T13:19:00+02:00
IP
People
SkyWater Names Bassel Haddad as Sr. Vice President and General Manager of Advanced Packaging
2024-09-16T14:13:00+02:00
Event
MSquare Technology Showcases Leadership in IP and Chiplet Innovation at the AI Hardware & Edge AI Summit
2024-09-16T07:32:00+02:00
Technical Papers
Complex Heterogeneous Integration Drives Innovation In Semiconductor Test
October 15, 2024
The Evolution of Photonic Integrated Circuits and Silicon Photonics
October 7, 2024
Flexible electronic-photonic 3D integration from ultrathin polymer chiplets
October 2, 2024
Enabling Innovative Multi-Vendor Chiplet-Based Designs
September 27, 2024
Alchip Reveals 3DIC Design Optimization Keys
2024-10-15T17:45:00+02:00
Eliyan Delivers Industry’s Highest Performing Chiplet Interconnect PHY at 64Gbps in 3nm Process
2024-10-10T07:02:00+02:00
Ayar CEO: ‘Copper Is Already Broken; Agentic AI Will Require Optical I/O’
2024-10-09T06:58:00+02:00
Faraday and Kiwimoore Succeed in 2.5D Packaging Project for Mass Production
2024-10-08T08:39:00+02:00
Chiplet
Alchip Reveals 3DIC Design Optimization Keys
2024-10-15T17:45:00+02:00
Business
Chiplet
Eliyan Delivers Industry’s Highest Performing Chiplet Interconnect PHY at 64Gbps in 3nm Process
2024-10-10T07:02:00+02:00
Commentary / Analysis
Ayar CEO: ‘Copper Is Already Broken; Agentic AI Will Require Optical I/O’
2024-10-09T06:58:00+02:00
Chiplet
Faraday and Kiwimoore Succeed in 2.5D Packaging Project for Mass Production
2024-10-08T08:39:00+02:00
Other
Hybrid bonding: A global picture of the IP competition
2024-10-07T10:15:00+02:00
Packages
Amkor and TSMC to Expand Partnership and Collaborate on Advanced Packaging in Arizona
2024-10-04T06:49:00+02:00
EDA
Faraday Enhances 3D-IC Design Service with Ansys Multiphysics Analysis
2024-10-03T15:14:00+02:00
Business
Commentary / Analysis
Global Semiconductor Packaging Material Market Outlook Shows Return to Growth Starting in 2024
2024-10-03T13:23:00+02:00
Commentary / Analysis
Partitioning In The Chiplet Era
2024-10-03T12:27:00+02:00
Chiplet Enablers
CEA-Leti Develops Active Optical Interposers to Connect Chiplets
2024-10-02T07:10:00+02:00
Packages
MRSI Mycronic introduces next generation high precision epoxy dispenser for advanced packaging
2024-10-01T07:48:00+02:00
IP
Commentary / Analysis
Barriers To Chiplet Sockets
2024-09-30T08:48:00+02:00
Commentary / Analysis
EDA
EDA
Synopsys and TSMC Pave the Path for Trillion-Transistor AI and Multi-Die Chip Design
2024-09-26T06:54:00+02:00
Event
IP
GUC Announces Adoption of HBM3E IP by CSP Data Center
2024-09-24T11:40:00+02:00
Commentary / Analysis
Optimizing Wafer Edge Processes For Chip Stacking
2024-09-23T12:34:00+02:00
People
Sehat Sutardja, Marvell co-founder, chiplet pioneer has died, aged 63
2024-09-23T12:11:00+02:00
Event
Commentary / Analysis
Advanced Packaging Drives New Memory Solutions for the AI Era
2024-09-19T13:09:00+02:00
Commentary / Analysis
What Comes After HBM For Chiplets
2024-09-18T09:10:00+02:00
Commentary / Analysis
Optical Chiplet Interconnect Promises to Accelerate Computing Apps
2024-09-18T08:58:00+02:00
Commentary / Analysis
Safety architecture boosts automotive GPU for chiplets
2024-09-17T13:19:00+02:00
IP
People
SkyWater Names Bassel Haddad as Sr. Vice President and General Manager of Advanced Packaging
2024-09-16T14:13:00+02:00
Event
MSquare Technology Showcases Leadership in IP and Chiplet Innovation at the AI Hardware & Edge AI Summit
2024-09-16T07:32:00+02:00
Technical Papers
Complex Heterogeneous Integration Drives Innovation In Semiconductor Test
October 15, 2024
The Evolution of Photonic Integrated Circuits and Silicon Photonics
October 7, 2024
Flexible electronic-photonic 3D integration from ultrathin polymer chiplets
October 2, 2024
Enabling Innovative Multi-Vendor Chiplet-Based Designs
September 27, 2024