High-Density Electronic-Photonic Chiplet
- Parallel electrical interface
- Supports AIB and other proprietary parallel interfaces
- 8 full-duplex optical ports
Chiplet Marketplace
Chiplet Marketplace is the world's most comprehensive Chiplet resource with over 200 Chiplets from 20 vendors and foundries
New Chiplet
UCIe AP based 8-bit 170-Gsps Chiplet Transceiver
- 2T2R chiplet configuration
- 160/175-GSa/s sample rate
- 7-bit resolution
UCIe based 8-bit 48-Gsps Transceiver
- 48-Gsps peak sample rate
- 8 bit resolution
- UCIe SP (16x lanes at 16Gbps) with streaming controller
UCIe based 12-bit 12-Gsps Transceiver
- 12-Gsps peak sample rate
- 12 bit resolution (programmable)
- UCIe SP (16x lanes at 16Gbps) with streaming controller
Parallel Single Mode (PSM) 16-channel 112 Gbps Transmitter Chiplet
- 16x DR4 specification compliant transmit channels including modulator and driver
- Digital SPI control interface
Active silicon interposer
- Network-On-Interposer
- 4 Tbps aggregate bisection bandwidth
100G optical I/O chiplets
- RANOVUS®’ Odin® optical I/O cores set industry benchmarks for high bandwidth, low power consumption and small size for AI, cloud, metaverse, and communications applications
Memory Chiplet
- Stealth Mode Products design to disrupt AI/Generative AI processing.
Transceiver Chiplet
- Die-level transceiver products with AIB or SerDes interfaces
Featured News
NAPMP announces chiplets R&D area
2024-11-06T07:59:00+01:00
Arm's Data Center Advances: Chiplets, Efficiency & AI Integration
2024-11-05T10:17:00+01:00
Chiplets Make Progress Using Interconnects As Glue
2024-10-31T13:44:00+01:00
Recent News
Business
NAPMP announces chiplets R&D area
2024-11-06T07:59:00+01:00
Deals
Commentary / Analysis
Arm's Data Center Advances: Chiplets, Efficiency & AI Integration
2024-11-05T10:17:00+01:00
Commentary / Analysis
Chiplets Make Progress Using Interconnects As Glue
2024-10-31T13:44:00+01:00
Business
Commentary / Analysis
Silicon Photonics Set for Takeoff
2024-10-30T14:07:00+01:00
Commentary / Analysis
Intel patents chiplet GPU design
2024-10-30T13:52:00+01:00
Commentary / Analysis
HBM5 20hi Stack to Adopt Hybrid Bonding Technology, Potentially Transforming Business Models
2024-10-30T13:44:00+01:00
Commentary / Analysis
imec: New Methods for 2.5D and 3D Integration
2024-10-30T12:49:00+01:00
Commentary / Analysis
Hybrid Bonding Makes Strides Toward Manufacturability
2024-10-28T13:16:00+01:00
Other
BoS Semiconductors joins UCIe Consortium for its ADAS chiplet SoC family
2024-10-28T10:47:00+01:00
Commentary / Analysis
Monolithic Vs. Heterogeneous Integration
2024-10-25T08:28:00+02:00
Foundries
Commentary / Analysis
Ayar Labs CEO: Optical Chiplets Coming to SOCs Soon
2024-10-23T11:49:00+02:00
Commentary / Analysis
Chiplet Marketplace, Sustainability Top Discussions at OCP Summit
2024-10-23T07:23:00+02:00
Commentary / Analysis
Outlook 2025: Embracing the chiplet journey
2024-10-17T14:00:00+02:00
Commentary / Analysis
Chiplet market to hit US$411B by 2035, transforming semiconductor industry
2024-10-17T08:34:00+02:00
Business
Chiplet
Business
Xscape Photonics Raises $44 Million Series A to Reimagine the AI Data Center
2024-10-16T07:15:00+02:00
Chiplet
Arm Total Design Ignites Growing Ecosystem of Arm-based Silicon for a Sustainable AI Datacenter
2024-10-16T06:59:00+02:00
Chiplet
ADTechnology Partners with Arm, Samsung Foundry, and Rebellions on AI CPU Chiplet Platform
2024-10-16T06:51:00+02:00
Chiplet Enablers
Berkeley Lab and Open Compute Project Collaborate to Advance Chiplet Technology for HPC
2024-10-16T06:23:00+02:00
IP
Egis Group Announces Strategic Collaboration with Arm to Drive AI HPC Chip Technology Innovation
2024-10-16T04:51:00+02:00
Packages
KLA Unveils Comprehensive IC Substrate Portfolio for a New Era of Advanced Semiconductor Packaging
2024-10-16T02:30:00+02:00
Chiplet
Alchip Reveals 3DIC Design Optimization Keys
2024-10-15T17:45:00+02:00
Business
Chiplet
Eliyan Delivers Industry’s Highest Performing Chiplet Interconnect PHY at 64Gbps in 3nm Process
2024-10-10T07:02:00+02:00
Commentary / Analysis
Ayar CEO: ‘Copper Is Already Broken; Agentic AI Will Require Optical I/O’
2024-10-09T06:58:00+02:00
Chiplet
Faraday and Kiwimoore Succeed in 2.5D Packaging Project for Mass Production
2024-10-08T08:39:00+02:00
Technical Papers
2D materials-based 3D integration for neuromorphic hardware
November 5, 2024
3D Integration, Advanced Metrology Shape the Semiconductor Landscape
November 4, 2024
Synopsys 3DIO Solution for Multi-Die Integration (2.5D/3D)
November 4, 2024
Communication Characterization of AI Workloads for Large-scale Multi-chiplet Accelerators
October 31, 2024
NAPMP announces chiplets R&D area
2024-11-06T07:59:00+01:00
Arm's Data Center Advances: Chiplets, Efficiency & AI Integration
2024-11-05T10:17:00+01:00
Chiplets Make Progress Using Interconnects As Glue
2024-10-31T13:44:00+01:00
Business
NAPMP announces chiplets R&D area
2024-11-06T07:59:00+01:00
Deals
Commentary / Analysis
Arm's Data Center Advances: Chiplets, Efficiency & AI Integration
2024-11-05T10:17:00+01:00
Commentary / Analysis
Chiplets Make Progress Using Interconnects As Glue
2024-10-31T13:44:00+01:00
Business
Commentary / Analysis
Silicon Photonics Set for Takeoff
2024-10-30T14:07:00+01:00
Commentary / Analysis
Intel patents chiplet GPU design
2024-10-30T13:52:00+01:00
Commentary / Analysis
HBM5 20hi Stack to Adopt Hybrid Bonding Technology, Potentially Transforming Business Models
2024-10-30T13:44:00+01:00
Commentary / Analysis
imec: New Methods for 2.5D and 3D Integration
2024-10-30T12:49:00+01:00
Commentary / Analysis
Hybrid Bonding Makes Strides Toward Manufacturability
2024-10-28T13:16:00+01:00
Other
BoS Semiconductors joins UCIe Consortium for its ADAS chiplet SoC family
2024-10-28T10:47:00+01:00
Commentary / Analysis
Monolithic Vs. Heterogeneous Integration
2024-10-25T08:28:00+02:00
Foundries
Commentary / Analysis
Ayar Labs CEO: Optical Chiplets Coming to SOCs Soon
2024-10-23T11:49:00+02:00
Commentary / Analysis
Chiplet Marketplace, Sustainability Top Discussions at OCP Summit
2024-10-23T07:23:00+02:00
Commentary / Analysis
Outlook 2025: Embracing the chiplet journey
2024-10-17T14:00:00+02:00
Commentary / Analysis
Chiplet market to hit US$411B by 2035, transforming semiconductor industry
2024-10-17T08:34:00+02:00
Business
Chiplet
Business
Xscape Photonics Raises $44 Million Series A to Reimagine the AI Data Center
2024-10-16T07:15:00+02:00
Chiplet
Arm Total Design Ignites Growing Ecosystem of Arm-based Silicon for a Sustainable AI Datacenter
2024-10-16T06:59:00+02:00
Chiplet
ADTechnology Partners with Arm, Samsung Foundry, and Rebellions on AI CPU Chiplet Platform
2024-10-16T06:51:00+02:00
Chiplet Enablers
Berkeley Lab and Open Compute Project Collaborate to Advance Chiplet Technology for HPC
2024-10-16T06:23:00+02:00
IP
Egis Group Announces Strategic Collaboration with Arm to Drive AI HPC Chip Technology Innovation
2024-10-16T04:51:00+02:00
Packages
KLA Unveils Comprehensive IC Substrate Portfolio for a New Era of Advanced Semiconductor Packaging
2024-10-16T02:30:00+02:00
Chiplet
Alchip Reveals 3DIC Design Optimization Keys
2024-10-15T17:45:00+02:00
Business
Chiplet
Eliyan Delivers Industry’s Highest Performing Chiplet Interconnect PHY at 64Gbps in 3nm Process
2024-10-10T07:02:00+02:00
Commentary / Analysis
Ayar CEO: ‘Copper Is Already Broken; Agentic AI Will Require Optical I/O’
2024-10-09T06:58:00+02:00
Chiplet
Faraday and Kiwimoore Succeed in 2.5D Packaging Project for Mass Production
2024-10-08T08:39:00+02:00
Technical Papers
2D materials-based 3D integration for neuromorphic hardware
November 5, 2024
3D Integration, Advanced Metrology Shape the Semiconductor Landscape
November 4, 2024
Synopsys 3DIO Solution for Multi-Die Integration (2.5D/3D)
November 4, 2024
Communication Characterization of AI Workloads for Large-scale Multi-chiplet Accelerators
October 31, 2024