The reference hub for the chiplet ecosystem

Where the chiplet marketplace starts with trust.

New Chiplets

Omni Design

High Performance Droplet

High-Performance Analog Front-Ends (AFEs): Essential for data acquisition and signal processing in various applications.
High-Speed Interfaces: Facilitating seamless communication between solutions. Omni Design supports various standards, including JESD204 and PCIe.
Custom Solutions: Omni Design can tailor SoC solutions to meet specific customer requirements.

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12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver

UCIe based Ka/Ku band transceiver
Wide Bandwidth
Scalable solution for dense mm-wave radio into single multi-chip modules

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MSquare Technology

Interconnect Chiplet

Integrates 16 complete UCIe modules, following the standard UCIe 1.1 standard
Integrates one complete HBM3 IP, including the controller and PHY, following the HBM3 JESD238 standard

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BOS Semiconductors

Automotive AI Accelerator

Eagle-N, the first of Eagle Chiplet SoC Family is an Automotive AI Accelerator which is a unique product in the market targeting IVI and ADAS acceleration based on PCIe interface or UCIe interface with host AP.

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Rebellions

HBM3e Advanced-packaging chiplet for all workloads

Scalable AI, fortified with high compute density and ample memory bandwidth

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Ayar Labs

High-Density Electronic-Photonic Chiplet

Parallel electrical interface
Supports AIB and other proprietary parallel interfaces
8 full-duplex optical ports

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New Chiplet-Ready IP

Omni Design

High Performance Droplet

High-Performance Analog Front-Ends (AFEs): Essential for data acquisition and signal processing in various applications.
High-Speed Interfaces: Facilitating seamless communication between solutions. Omni Design supports various standards, including JESD204 and PCIe.
Custom Solutions: Omni Design can tailor SoC solutions to meet specific customer requirements.

Learn more

12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver

UCIe based Ka/Ku band transceiver
Wide Bandwidth
Scalable solution for dense mm-wave radio into single multi-chip modules

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UCIe AP based 8-bit 170-Gsps Chiplet Transceiver

2T2R chiplet configuration
160/175-GSa/s sample rate
7-bit resolution

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Ranovus

100G optical I/O chiplets

RANOVUS®’ Odin® optical I/O cores set industry benchmarks for high bandwidth, low power consumption and small size for AI, cloud, metaverse, and communications applications

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Memory Chiplet

Stealth Mode Products design to disrupt AI/Generative AI processing.

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Achronix Semiconductor

Speedcore eFPGA Chiplet

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More Chiplet-Ready IP

Insights

Ecosystem Highlights

CoAsia SEMI Announces AI Chiplet Production Collaboration With Tenstorrent

2026-01-12T07:20:00+00:00

Cadence Launches Partner Ecosystem to Accelerate Chiplet Time to Market

2026-01-06T14:16:00+00:00

Where co-packaged optics (CPO) technology stands in 2026

2025-12-30T18:22:01+00:00

Qualcomm Completes Acquisition of Alphawave Semi

2025-12-18T10:33:00+00:00

Expert Perspectives

5 Chiplets Design Challenges Hampering Wider Take-off

By Rob Kruger

January 13, 2026

Scalable Testing of Xanadu’s Canadian made Quantum Photonic Chips with MPI Corporation’s Advanced Electro-Optic Probe Systems

By Lawrence van der Vegt, MPI Corporation and Matheus Adam, Xanadu Quantum Technologies Inc.

January 12, 2026

Addressing challenges and embracing advances with photonic package design

By Dr Larry Zu, CEO

January 12, 2026

Advancing Europe’s Automotive Chiplet Vision: Arteris Joins CHASSIS to Accelerate Software-Defined Mobility

By Arteris

January 7, 2026

More Expert Perspectives

Recent Updates

CoAsia SEMI Announces AI Chiplet Production Collaboration With Tenstorrent

2026-01-12T07:20:00+00:00

Cadence Launches Partner Ecosystem to Accelerate Chiplet Time to Market

2026-01-06T14:16:00+00:00

Ambiq and Bravechip Cut Smart Ring Costs by 85% with New Edge AI Chiplet

2026-01-06T12:30:00+00:00

TI accelerates the shift toward autonomous vehicles with expanded automotive portfolio

2026-01-06T08:04:47+00:00

Where co-packaged optics (CPO) technology stands in 2026

2025-12-30T18:22:01+00:00

Qualcomm Completes Acquisition of Alphawave Semi

2025-12-18T10:33:00+00:00

More news

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Technical Library

Whitepapers & Technical Articles

Development and Optimization of Fine-Pitch RDL for RDL Interposer, and Embedded Bridge Die Interposer Fabrication Using Fan-Out Wafer-Level Packaging Technology

By Jung Won Lee, Nepes Corporation

January 13, 2026

Thermo-mechanical co-design of 2.5D flip-chip packages with silicon and glass interposers via finite element analysis and machine learning

By Mohammad Rafiee, University of Ottawa

January 7, 2026

High-Efficient and Fast-Response Thermal Management by Heterogeneous Integration of Diamond on Interposer-Based 2.5D Chiplets

By Ningning Xu, Xiamen University

January 5, 2026

HexaMesh: Scaling to Hundreds of Chiplets with an Optimized Chiplet Arrangement

By Patrick Iff, ETH Zurich

January 5, 2026

Videos

The State of Multi-Die: Insights and Customer Requirements

The State of Multi-Die: Insights and Customer Requirements

By Shekhar Kapoor, Synopsys

January 12, 2026

EETimes

Coding approaches for increasing reliability and energy efficiency of 3D technologies

Coding approaches for increasing reliability and energy efficiency of 3D technologies

By Alberto Garcia-Ortiz

December 30, 2025

AI-Driven Thermal Prediction for Enhanced Reliability in 3D HBM Chiplets

AI-Driven Thermal Prediction for Enhanced Reliability in 3D HBM Chiplets

By Tahani Aladwani

December 29, 2025

Rearchitecting AI Infrastructure with General Purpose and Accelerator Chiplets

Rearchitecting AI Infrastructure with General Purpose and Accelerator Chiplets

By Ar, Meta, Rebellions and Novatek

December 17, 2025

Arm