Automakers And Industry Need Specific, Extremely Robust, Heterogeneously Integrated Chiplet Solutions
Comprehensive testing is needed to ensure that chiplet systems can withstand extreme conditions.
By Andy Heinig, Fraunhofer Institute of Integrated Circuits
SemiEngineering (December 12, 2024)
Chiplets offer great potential for the automotive and industrial sectors, especially as these applications often have high performance requirements but are needed only in small quantities. The modular principle behind chiplets enables efficient design and production: individual components have to be produced only once and can then be flexibly combined to create tailored solutions. This offers major advantages when it comes to the cost-effective production of high-performance specialized chips. However, using chiplets in these demanding sectors poses particular challenges.
To read the full article, click here
Related Chiplet
- FlexGen Multi-Die Smart Network-on-Chip (NoC) IP
- Ncore Multi-Die Interconnect IP
- Integrated voltage regulator (IVR) chiplet
- High-performance connectivity chiplets
- eFPGA Chiplet
Related Technical Papers
- Fault Modeling, Testing, and Repair for Chiplet Interconnects
- Stop-For-Top IP model to replace One-Stop-Shop by 2025... and support the creation of successful Chiplet business
- Chiplet Strategy is Key to Addressing Compute Density Challenges
- RapidChiplet: A Toolchain for Rapid Design Space Exploration of Chiplet Architectures
Latest Technical Papers
- Toward Multi-kW Power Delivery Methodologies for Advanced 3D Heterogeneous Integration
- Cu-Cu Hybrid Bonding for Chiplets Heterogeneous Integration
- Location-Aware Caching Mechanism for minimizing performance degradation induced by inefficient inter-chiplet data path
- Predicting Cure Evolution and Thermal Endurance of a Highly Filled Epoxy Underfill for Advanced Packaging
- A Unified Interconnection Network for Chiplet-Based Scaling of the BrainScaleS Neuromorphic System