Architecting Next Generation Compute and I/O Chiplet for AI/ML, Cloud and Edge Platforms
By Sue Hung Fung, AlphaWave Semi and Sridhar Valluru, Arm
Alphawave Semi has introduced the industry’s first off-the-shelf I/O chiplet. This chiplet features UCIe die-to-die interconnect, along with multi-mode protocol support for Ethernet, PCIe, and CXL. Leveraging these advanced high-speed interconnects for I/O with a bandwidth throughput of up to 1.6Tbps, this chiplet can enable modular design and integration of future generations, facilitating enhanced performance and flexibility.
Alphawave Semi offers a diverse range of chiplets to advance modular design and architecture. Combined with the new ARM Neoverse compute chiplet and various memory chiplets, the chiplet portfolio offering allows the creation of sophisticated high-performance systems that can readily adapt to dynamically evolving AI/ML and data center needs using scalability while future-proofing chiplet designs with next generation silicon proven IP.
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