How to Design Smarter: System-level multiphysics in 3D integration
What does “multiphysics” really mean in 3D IC design, and why is it more important than ever to start early?
In this episode of the Siemens 3D IC Podcast, host John McMillan is joined by returning guest John Ferguson, Senior Director of Product Management for Calibre 3D IC Solutions at Siemens EDA, and first-time guest Tarek Ramadhan, Application Engineering Manager for 3D IC Technical Solutions.
Together, they explore why traditional SoC methodologies fall short in the 3D world, how early predictive analysis can save teams from costly late-stage surprises, and why effective collaboration across domains (and companies) is essential. From thermal and stress concerns to data format mismatches and emerging standards like 3D Blocks, this episode delivers powerful insight into future-ready 3D IC design.
Whether you're an IC designer, system architect, packaging engineer, RTL and ESD teams, or anyone involved in the transition from 2D to 3D IC workflows, this episode offers valuable insights.
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