Scaling Connectivity for Chiplet-Based AI Systems

Tony Chan Carusone, Chief Technology Officer, Alphawave Semi
Chiplet Summit 2025

Chiplets are paving the way for the next generation of AI systems. They are the key to scaling AI connectivity and compute. Immediate applications include scale-up, where chiplets enable more processing power within a system, and scale-out, where multiple chiplet-based systems work together. Advanced switches leverage chiplets to enhance data transfer rates and reduce latency. Meanwhile, optical connectivity, facilitated by chiplets, offers high-speed data transmission with lower power consumption, crucial for handling the massive data loads in AI applications.

Introduction
The New AI Era
Relentless Growth in Data
Challenge #1
AI in the Data Centre – Proliferating Connectivity
Scaling Up and Out
Challenge #2
Challenge #3
Solutions for AI Scaling
Interfaces for Scaling AI Compute
Interfaces for Scaling AI Compute
Die-to-Die Interfaces based on UCIe
Die-to-Die Interface Use Cases
Evolution of Die-to-Die Interfaces
Die-to-Die Interface Use Cases
Multi-Protocol I/O Connectivity Chiplet
Die-to-Die Interface Use Cases
AI Hardware Based on Chiplets
Extension to Co-Packaged Optics
Potential Future: Energy Efficient Accelerator Card
Takeaways