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Heterogeneous Packaging Technologies for Chiplet and Memory Integration
By Yan Li, WooPoung Kim
Samsung Semiconductor Inc. San Jose, USA
Table of Content
Heterogeneous Packaging Technologies for Chiplet and Memory Integration
Outline
Introduction - Advanced Packaging techniques are utilized to meet the market needs
Introduction - Chiplet; Heterogenous integration; die stacking
Introduction - Technical and Logistic Challenges
Introduction - Technical and Logistic Challenges
Introduction - Technical and Logistic Challenges
Chiplet Based Heterogeneous Integration Platform
Chiplet Based Heterogeneous Integration Platform
Innovative Memory Integration Solutions - 3D Memory Integration
Innovative Memory Integration Solutions - 3D Custom HBM
Innovative Memory Integration Solutions - HCB replacing TCB in 3D die stacking
Innovative Memory Integration Solutions - HCB replacing TCB in HBM
Innovative Memory Integration Solutions
Novel Integrated Stack Capacitors (ISC) integration
Novel Integrated Stack Capacitors (ISC) integration
Novel Integrated Stack Capacitors (ISC) integration
Conclusion
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