Eliyan joins Arm Total Design ecosystem to accelerate chiplet economy

• Eliyan Joins Arm Total Design Ecosystem, Supporting the Foundation Chiplet System Architecture (FCSA) Contributed by Arm to the Open Compute Project
• Collaboration strengthens open chiplet interoperability and scalable silicon platforms to power the next generation of AI and high-performance computing systems.

Santa Clara, Calif. — November 11, 2025 —Eliyan Corporation, a pioneer in advanced chiplet interconnect technologies, today announced a collaboration with leading compute platform company, Arm, to accelerate the development of open, scalable chiplet-based architectures for AI and high-performance computing (HPC).

As part of this collaboration, Eliyan has joined the Arm® Total Design ecosystem and will support the new Foundation Chiplet System Architecture (FCSA), a vendor- and CPU-architecture-neutral specification contributed by Arm to the Open Compute Project (OCP). Together with other ecosystem partners, the companies will advance open standards and interoperable chiplet design frameworks that drive performance, bandwidth, and power efficiency across next-generation systems.

Eddie Ramirez, vice president of go-to-market, Infrastructure Business, Arm, said: “Chiplet-based design is reshaping how the industry builds scalable infrastructure for AI. Eliyan’s die-to-die interconnect technology will be a valued addition to the Arm Total Design ecosystem, helping accelerate the development of highly performant and optimized solutions across the chiplet supply chain.”

Eliyan’s NuLink™ technology, a high-speed die-to-die and chip-to-chip interconnect, addresses the key I/O and memory walls that limit AI and HPC system scalability. Supporting data rates beyond 64Gbps single-ended and 224Gbps differential at industry most differentiating power efficiencies, NuLink™ enables designers to integrate more compute and memory within a given power and area envelope.

Ramin Farjadrad, CEO and Co-Founder, Eliyan, said: “With the IO and memory walls standing as key challenges to scaling performance and power efficiency, we are pleased to bring our industry-leading high-speed die-to-die and chip-to-chip interconnect technology to the Arm Total Design initiative and the Foundation Chiplet System Architecture (FCSA) specification. Eliyan’s NuLink™ chip and chiplet offerings complement the ecosystem Arm has assembled to advance the collaboration required for an open chiplet economy and scalable platforms for AI and HPC.”

The collaboration between Arm and Eliyan builds on the rapid growth of the Arm Total Design ecosystem, which has tripled in size since its launch in 2023. With the addition of new members such as Eliyan, the ecosystem now spans the full silicon design lifecycle – from IP and EDA tools to manufacturing, advanced packaging, and system validation.

By combining Arm’s leadership in power-efficient compute and open standards with Eliyan’s expertise in high-bandwidth, low-power interconnect design, the two companies are helping chart a path toward sustainable, AI-ready infrastructure that is powerful, open, and accessible to all.

About Eliyan

Eliyan Corporation is leading the chiplet revolution, focusing on a fundamental challenge with scaling semiconductor performance, size, power, and cost to meet the needs of high-performance computing applications. It has developed a breakthrough technology to enable the industry’s highest performing die-to-die, and chip-to-chip interconnect for homogenous and heterogenous multi-die architectures using either standard or advanced packaging, enabling increased sustainability through reduction in costs, manufacturing waste and power consumption.  More information can be found here: www.eliyan.com