Primemas Selects Achronix Embedded FPGA Technology For System-on-Chip (SoC) Hub Chiplet Platform
2024-06-19 13:22:00
Deals
Recent News
Ansys Enables 3D Multiphysics Visualization of Next-Generation 3D-IC Designs with NVIDIA Omniverse
2024-06-19 13:00:00
EDA
Global Semiconductor Fab Capacity Projected to Expand 6% in 2024 and 7% in 2025, SEMI Reports
2024-06-18 15:04:00
Commentary / Analysis
Imec demonstrates functional monolithic CFET devices with stacked bottom and top contacts
2024-06-18 12:48:00
Other
Alphawave Semi’s quest for open chiplet ecosystem
2024-06-17 14:27:00
Commentary / Analysis
Rapid AI and HPC Requires Collaboration and Co-optimization
2024-06-17 11:02:00
Commentary / Analysis
EV Group and Fraunhofer IZM-ASSID Expand Partnership in Wafer Bonding for Quantum Computing Applications
2024-06-13 20:13:00
Advanced Packaging
Alphawave Semi Tapes Out Industry-First, Multi-Protocol I/O Connectivity Chiplet for High-Performance Compute and AI Infrastructure
2024-06-13 13:19:00
Chiplet
SEMIFIVE Collaborates with OPENEDGES on Chiplet Development
2024-06-13 05:11:00
Business
Polar Bear Tech secures new funding to develop first independent chiplet product library
2024-06-13 03:01:00
Business
Cadence and Samsung Foundry Accelerate Chip Innovation for Advanced AI and 3D-IC Applications
2024-06-13 02:27:00
EDA
Shin-Etsu Chemical: Developing equipment to manufacture semiconductor package substrates for the back end process and pursuing a new manufacturing method
2024-06-12 20:07:00
Advanced Packaging
A closer look at Arm’s chiplet game plan
2024-06-12 19:31:00
Commentary / Analysis
Siemens collaborates with Samsung Foundry to expand 3D-IC enablement tools, optimize other EDA solutions for foundry’s newest processes
2024-06-12 18:02:00
EDA
Top 10 Global Foundries at 4.3% QoQ Drop in 1Q24 Revenue as SMIC Climbed to 3rd Spot
2024-06-12 17:07:00
Commentary / Analysis
Adeia’s Pioneering Hybrid Bonding Technology Continues to Capture Attention
2024-06-12 16:25:00
Advanced Packaging
Ayar Labs Welcomes Intel Veteran Pooya Tadayon as VP of Packaging and Test
2024-06-12 06:33:00
People
Alphawave Semi Collaborates with Arm on High-Performance Compute Chiplet
2024-06-06 13:02:00
Business
Ambiq and Bravechip collaborate on energy-efficient smart ring chiplet
2024-06-05 14:49:00
Chiplet
Intel details TSMC-made Lunar Lake processor for AI PCs
2024-06-05 08:52:00
Commentary / Analysis
Ansys Enables 3D Multiphysics Visualization of Next-Generation 3D-IC Designs with NVIDIA Omniverse
2024-06-19 13:00:00
EDA
Global Semiconductor Fab Capacity Projected to Expand 6% in 2024 and 7% in 2025, SEMI Reports
2024-06-18 15:04:00
Commentary / Analysis
Imec demonstrates functional monolithic CFET devices with stacked bottom and top contacts
2024-06-18 12:48:00
Other
Alphawave Semi’s quest for open chiplet ecosystem
2024-06-17 14:27:00
Commentary / Analysis
Rapid AI and HPC Requires Collaboration and Co-optimization
2024-06-17 11:02:00
Commentary / Analysis
EV Group and Fraunhofer IZM-ASSID Expand Partnership in Wafer Bonding for Quantum Computing Applications
2024-06-13 20:13:00
Advanced Packaging
Alphawave Semi Tapes Out Industry-First, Multi-Protocol I/O Connectivity Chiplet for High-Performance Compute and AI Infrastructure
2024-06-13 13:19:00
Chiplet
SEMIFIVE Collaborates with OPENEDGES on Chiplet Development
2024-06-13 05:11:00
Business
Polar Bear Tech secures new funding to develop first independent chiplet product library
2024-06-13 03:01:00
Business
Cadence and Samsung Foundry Accelerate Chip Innovation for Advanced AI and 3D-IC Applications
2024-06-13 02:27:00
EDA
Shin-Etsu Chemical: Developing equipment to manufacture semiconductor package substrates for the back end process and pursuing a new manufacturing method
2024-06-12 20:07:00
Advanced Packaging
A closer look at Arm’s chiplet game plan
2024-06-12 19:31:00
Commentary / Analysis
Siemens collaborates with Samsung Foundry to expand 3D-IC enablement tools, optimize other EDA solutions for foundry’s newest processes
2024-06-12 18:02:00
EDA
Top 10 Global Foundries at 4.3% QoQ Drop in 1Q24 Revenue as SMIC Climbed to 3rd Spot
2024-06-12 17:07:00
Commentary / Analysis
Adeia’s Pioneering Hybrid Bonding Technology Continues to Capture Attention
2024-06-12 16:25:00
Advanced Packaging
Ayar Labs Welcomes Intel Veteran Pooya Tadayon as VP of Packaging and Test
2024-06-12 06:33:00
People
Alphawave Semi Collaborates with Arm on High-Performance Compute Chiplet
2024-06-06 13:02:00
Business
Ambiq and Bravechip collaborate on energy-efficient smart ring chiplet
2024-06-05 14:49:00
Chiplet
Intel details TSMC-made Lunar Lake processor for AI PCs
2024-06-05 08:52:00
Commentary / Analysis