Optical Transmission Modulation Methods Advance
By Robert Huntley, EETimes Europe (November 21, 2024)
With our society’s instantiable appetite for consuming vast amounts of data, it is no surprise that the back-end data networks must constantly evolve. Most high-throughput data networks rely on optical transmission methods to transfer data, with two dominant modulation techniques: 4-level pulse amplitude modulation (PAM4) and coherent modulation. PAM4, where each amplitude level represents two bits, is a bandwidth-efficient modulation technique that suits short-range (< 10km) applications. Coherent modulation, which involves the modulation of a coherent light source’s amplitude, phase and polarization, is more suited to high-speed, long-distance (>10km) transmission. Both modulation techniques are in demand as the race is on to achieve transfer rates of up to 800 Gbps. There are signs that as each technique evolves, the differences in cost, simplicity and power consumption between them will reduce.
EE Times Europe spoke with Tony Chan Carusone, chief technology officer of Alphawave Semi (London, U.K.), to discover the underlying applications driving bandwidth demand and to find out if PAM4 and coherent modulation techniques are ever likely to converge.
To read the full article, click here
Related Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Interconnect Chiplet
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related News
- ASMPT and IBM Deepen Collaboration to Advance Bonding Methods for Chiplet Packages for AI
- MRSI Mycronic announces advanced high-speed 1μm die bonder MRSI-LEAP for ultra-high-volume manufacturing of AI optical module applications
- How can in-package optical interconnects enhance chiplet generative AI performance?
- How does UCIe on chiplets enable optical interconnects in data centers?
Latest News
- Multi-Die Assemblies Complicate Parasitic Extraction
- Alphawave Semi at the Forefront of PCIe® 7.0 Specification: Showcasing Next-Gen Chiplet Interoperability and Optical PCIe Technology at PCI-SIG® Developers Conference 2025
- Nordson Electronics Solutions Develops Panel-Level Packaging Solution for Powertech Technology, Inc. that Achieves Yields Greater than 99% for Underfilling During Semiconductor Manufacturing
- QuickLogic Joins Intel Foundry Chiplet Alliance
- Qualitas Semiconductor Successfully Develops UCIe v2.0-Compliant PHY IP, Enabling Up to 512Gbps Die-to-Die Connectivity