DreamBig closes $75M Series B Funding Round, Co-led by Samsung Catalyst Fund and Sutardja Family to Enable AI Inference and Training Solutions to the Masses
2024-07-16 16:32:00
Business
Recent News
OPENEDGES Successfully Validated Its 7nm HBM3 Testchip
2024-07-15 04:55:00
IP
Biden-Harris Administration to Invest Up to $1.6 Billion to Establish and Accelerate Domestic Capacity Advanced Packaging
2024-07-10 06:50:00
Business
Samsung Electronics To Provide Turnkey Semiconductor Solutions With 2nm GAA process and 2.5D Package to Preferred Networks
2024-07-09 15:20:00
Foundries
YorChip predicts 2026 will be the year of the chiplet
2024-07-04 06:16:00
Commentary / Analysis
Silicon Box selects Piedmont to host €3.2B chip foundry for Italian expansion
2024-06-28 13:44:00
Business
Intel Demonstrates First Fully Integrated Optical I/O Chiplet
2024-06-26 17:58:00
Chiplet
Chiplets drive new automated design tools at Leti
2024-06-26 13:00:00
Commentary / Analysis
Synopsys Accelerates Chip Innovation with Production-Ready Multi-Die Reference Flow for Intel Foundry
2024-06-25 07:24:00
EDA
JEDEC® Announces Publication of Compute Express Link® (CXL®) Support Standards
2024-06-25 06:58:00
Standards
Siemens and Intel Foundry collaborate to deliver new tools certifications and EMIB/3D-IC innovation
2024-06-25 06:43:00
EDA
Baya Systems and Blue Cheetah Partner to Deliver Chiplet Interconnect Solutions
2024-06-24 15:09:00
IP
Siemens delivers a major leap toward mainstream 3D-IC adoption with new Calibre 3DThermal
2024-06-24 14:34:00
EDA
Siemens introduces Innovator3D IC - a comprehensive multiphysics cockpit for 3D IC design, verification and manufacturing
2024-06-24 14:12:00
EDA
Sarcina Unveils Bump Pitch Transformer Capabilities New Multi-die Technology Radically Alters 2.5D Packaging Landscape
2024-06-24 07:45:00
Advanced Packaging
Tenstorrent Licenses Baya Systems’ Fabric into next-generation AI and Compute Chiplet Solutions
2024-06-21 20:19:00
Deals
On chip voltage regulator IP for chiplets and SoCs
2024-06-21 13:13:00
IP
Baya Systems Introduces New Technology to Transform SoCs and Chiplets for Emerging Applications
2024-06-20 19:55:00
EDA
YorChip announces Low Latency 200G Chiplet for edge AI
2024-06-19 14:15:00
Chiplet
System-level UCIe IP for early architecture analysis of 3D Chiplet Design and Packaging
2024-06-19 13:31:00
IP
OPENEDGES Successfully Validated Its 7nm HBM3 Testchip
2024-07-15 04:55:00
IP
Biden-Harris Administration to Invest Up to $1.6 Billion to Establish and Accelerate Domestic Capacity Advanced Packaging
2024-07-10 06:50:00
Business
Samsung Electronics To Provide Turnkey Semiconductor Solutions With 2nm GAA process and 2.5D Package to Preferred Networks
2024-07-09 15:20:00
Foundries
YorChip predicts 2026 will be the year of the chiplet
2024-07-04 06:16:00
Commentary / Analysis
Silicon Box selects Piedmont to host €3.2B chip foundry for Italian expansion
2024-06-28 13:44:00
Business
Intel Demonstrates First Fully Integrated Optical I/O Chiplet
2024-06-26 17:58:00
Chiplet
Chiplets drive new automated design tools at Leti
2024-06-26 13:00:00
Commentary / Analysis
Synopsys Accelerates Chip Innovation with Production-Ready Multi-Die Reference Flow for Intel Foundry
2024-06-25 07:24:00
EDA
JEDEC® Announces Publication of Compute Express Link® (CXL®) Support Standards
2024-06-25 06:58:00
Standards
Siemens and Intel Foundry collaborate to deliver new tools certifications and EMIB/3D-IC innovation
2024-06-25 06:43:00
EDA
Baya Systems and Blue Cheetah Partner to Deliver Chiplet Interconnect Solutions
2024-06-24 15:09:00
IP
Siemens delivers a major leap toward mainstream 3D-IC adoption with new Calibre 3DThermal
2024-06-24 14:34:00
EDA
Siemens introduces Innovator3D IC - a comprehensive multiphysics cockpit for 3D IC design, verification and manufacturing
2024-06-24 14:12:00
EDA
Sarcina Unveils Bump Pitch Transformer Capabilities New Multi-die Technology Radically Alters 2.5D Packaging Landscape
2024-06-24 07:45:00
Advanced Packaging
Tenstorrent Licenses Baya Systems’ Fabric into next-generation AI and Compute Chiplet Solutions
2024-06-21 20:19:00
Deals
On chip voltage regulator IP for chiplets and SoCs
2024-06-21 13:13:00
IP
Baya Systems Introduces New Technology to Transform SoCs and Chiplets for Emerging Applications
2024-06-20 19:55:00
EDA
YorChip announces Low Latency 200G Chiplet for edge AI
2024-06-19 14:15:00
Chiplet
System-level UCIe IP for early architecture analysis of 3D Chiplet Design and Packaging
2024-06-19 13:31:00
IP