Sign In
English
US - English
China - 简体中文
Chiplet Marketplace
Chiplets
Compute & Acceleration
Domain-Specific Accelerator
AI / ML Accelerator
FPGA
GPU
CPU / General-Purpose Processor
Memory & Storage
Memory
Memory Controller
Memory PHY
Interconnect & IO
Serdes
Optical IO / Photonic
High-Speed IO
Die-to-Die (D2D) Interconnect
Analog, RF & Mixed-Signal
RF & mmWave
Clocking & Timing
Power Management
Data Converters (ADC / DAC)
Analog Front-End
System & Platform
System Control / Management
Security / Root of Trust
Telemetry & Monitoring
Fabric / NoC / Switch
Chiplet-Ready IP
Compute & Acceleration
Domain-Specific Accelerator
AI / ML Accelerator
FPGA
GPU
CPU / General-Purpose Processor
Memory & Storage
Memory
Memory Controller
Memory PHY
Interconnect & IO
Serdes
Optical IO / Photonic
High-Speed IO
Die-to-Die (D2D) Interconnect
Analog, RF & Mixed-Signal
RF & mmWave
Clocking & Timing
Power Management
Data Converters (ADC / DAC)
Analog Front-End
System & Platform
System Control / Management
Security / Root of Trust
Telemetry & Monitoring
Fabric / NoC / Switch
Ecosytem
Chiplet Vendors
IP Vendors
Advanced Packaging
EDA Tool Suppliers
OSAT
Equipment
Standard
Process
Interconnect
Chiplet Integrators
Photonics
Services
Production Services
ASIC Design
Insights
Industry updates
Expert perspectives
Technical Library
Technical Papers
Videos
Slides
Wiki
Mixed Chiplet systems with wide range of nodes is becoming real
By Kash Johal, CEO, YorChip
Table of Content
Multi-Die already dominant in Performance
SOC market & Heterogenous Chiplets
Mid-Tier ASICs will be initial Markets
Time to Market is Key Chiplet Advantage
Mid Tier ASICs are our KEY Chiplet Markets
YorChip's Unique UCIe PHY & Fabric Optimized for Custom Silicon & Chiplets
YorChip – Strong Partners, & Market
Markets where Heterogenous wins
About YorChip Inc
Join our Team
Contact Info
×
Unlock this presentation
Sign In
Register for Free
