Silicon Box to build €3.2 billion Italian chiplet factory
By Peter Clarke, eeNews Europe (March 11, 2024)
Singapore startup Silicon Box Pte. Ltd. will spend €3.2 billion (about US$3.5 billion) building a chiplet packaging factory in northern Italy, newswires quote Industry Minister Adolfo Urso saying Monday morning.
The plant is expected to create 1,600 jobs when operating at full capacity.
The minister did not expound on how large a subsidy the authorities would provide or where the money would come from. Nor was the location of the plant given.
“Recent global upheavals highlight the need to build a more resilient supply chain for semiconductors in Europe,” Urso is quoted saying by Bloomberg and Reuters.
To read the full article, click here
Related Chiplet
- FlexGen Multi-Die Smart Network-on-Chip (NoC) IP
- Ncore Multi-Die Interconnect IP
- Integrated voltage regulator (IVR) chiplet
- High-performance connectivity chiplets
- eFPGA Chiplet
Related News
- Silicon Box selects Piedmont to host €3.2B chip foundry for Italian expansion
- Silicon Box welcomes European Commission approval of €1.3 billion Italian State aid measure to support new advanced packaging facility in Novara
- GlobalFoundries, Infineon, Silicon Box, STATS ChipPAC, TIER IV Join imec Automotive Chiplet Program
- Open EU Foundry status granted to innovative chiplet facility
Latest News
- Silicon Box Ships 1 Billion Units, 2 Billion Year-End Production Target
- Applied Materials and Besi Expand Strategic Partnership to Advance Next-Generation Packaging for AI Scaling
- ficonTEC & HTSI Announce Strategic Cooperation to Scale Advanced CPO Test Solutions in Taiwan
- SignatureIP Unveils IP Library for Chiplet-based AI, HPC and Data Center Systems
- AI Drives Larger, Denser Packaging, Raising New Challenges for Equipment Makers