A shift to photonics for data center networks and AI is underway
By Sally Cole Johnson, Laser Focus (November 4, 2024)
Ayar Labs’ Terry Thorn, vice president of commercial operations, shares details about the company’s second-gen optical chiplet and light source—with engineering samples out in 2025.
Ayar Labs is pioneering a solution to the biggest bottleneck within artificial intelligence (AI) system architectures: High-bandwidth movement of data primarily between compute chips, such as graphical processing units (GPUs) or central processing units (CPUs).
Today, this traffic is routed electrically on copper. But the electrical architecture is rapidly approaching the end of its roadmap, and optical signaling offers a more sophisticated way forward. Chip-to-chip communications of the future will require photonics.
To read the full article, click here
Related Chiplet
Related News
- Scintil Photonics, Presto Engineering and CEA-Leti Receive Bpifrance Grant for the CanopAI Project to Advance Photonic Integration for AI and Data Centers
- AI Data Centers Push Silicon Photonics Toward 300-mm Scale
- Xscape Photonics Raises $44 Million Series A to Reimagine the AI Data Center
- Tower Semiconductor Teams with NVIDIA to Advance AI Infrastructure with 1.6T Data Center Optical Modules
Latest News
- Innolux's Deployment of Key FOPLP Technologies: Leading Next-Gen Advanced Packaging and Seizing AI Opportunities
- Wiwynn, Ayar Labs, and GUC Advance Co-Packaged Optics with Live Demonstration of Integrated Optical Compute System at OCP Global Summit 2026
- ForwardEdge ASIC Announces UCIe 3.0 IP Solution to Accelerate Next-Generation Chiplet-Based ASIC Innovation
- Eliyan Introduces NuLight™: World’s First 2D microVCSEL Interconnect Solution to the Copper Wall
- Evatec delivers first CLUSTERLINE® 310 for Advanced Packaging on small panel formats